초록 ▼

Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integ

Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integrally connected together in an array format. Image sensors are attached and electrically connected to corresponding individual substrates. An adhesive layer attaches the molded window array to the substrate. The substrate and attached molded window array are singulated into a plurality of individual image sensor packages.

대표청구항 ▼

1. A method comprising:forming a plurality of moldings simultaneously in a mold, said plurality of moldings being integrally connected together; removing a molded window array comprising said plurality of moldings from said mold; aligning said molded window array with a substrate; and bringing said

1. A method comprising:forming a plurality of moldings simultaneously in a mold, said plurality of moldings being integrally connected together; removing a molded window array comprising said plurality of moldings from said mold; aligning said molded window array with a substrate; and bringing said molded window array into abutting contact with said substrate.