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Densely finned tungsten carbide and polycrystalline diamond cooling module

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0677666 (2000-10-04)
발명자 / 주소
  • David R. Hall
  • Joe Fox
인용정보 피인용 횟수 : 51  인용 특허 : 9

초록

An actively cooled, heat-dissipating module is presented for dissipating thermal energy from a heat producing integrated circuit device. The heat-dissipating module features a tungsten carbide body having high-density fins and a base with an interfacial surface adapted for attachment to an IC device

대표청구항

1. A heat dissipating module, comprising:a. a tungsten carbide element comprising a first surface having a plurality of fins and a second surface opposing the first surface suitable for bonding to a buffer element; b. the buffer element consisting of polycrystalline diamond, produced by the high-pre

이 특허에 인용된 특허 (9)

  1. Moore, Richard M., Aerodynamically enhanced heat sink.
  2. Scott Danny E. ; Smith Redd H. ; Horton Ralph M. ; Chaves Arthur A., Cutting element with controlled superabrasive contact area, drill bits so equipped.
  3. Yamamoto Yoshiyuki (Itami JPX) Tsuno Takashi (Itami JPX) Imai Takahiro (Itami JPX) Fujimori Naoji (Itami JPX), Heat sink and a process for the production of the same.
  4. Currie Thomas P. (St. Paul MN), Heat sink assembly for cooling electronic components.
  5. Mishuku Minoru,JPX ; Terada Osamu,JPX, Heat sinks and process for producing the same.
  6. Fox Leslie (Boxboro MA) Wade Paul C. (Shirley MA), Hybird cooling system for electronic components.
  7. Fuesser Hans-Juergen,DEX ; Zachai Reinhard,DEX ; Muench Wolfram,DEX ; Gutheit Tim,DEX, Microcooling device and method of making it.
  8. DiGiacomo Giulio ; Drofitz ; Jr. Stephen S. ; Edwards David L. ; Gross Larry D. ; Iruvanti Sushumna ; Sherif Raed A. ; Shinde Subhash L. ; Womac David J. ; Goland David B. ; Herron Lester W., Multi-chip heat-sink cap assembly.
  9. Kurokawa Yasuhiro (Tokyo JPX), Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing.

이 특허를 인용한 특허 (51)

  1. Sung,Chien Min, Carbonaceous composite heat spreader and associated methods.
  2. Wood, Trevor Howard; Wetzel, Todd Garrett; Luedke, Jonathan Glenn; Tucker, Thomas Michael, Combined surface cooler and acoustic absorber for turbomachines.
  3. Sung,Chien Min, Diamond composite heat spreader and associated methods.
  4. Sung,Chien Min, Diamond composite heat spreader having thermal conductivity gradients and associated methods.
  5. Sung,Chien Min, Diamond composite heat spreader having thermal conductivity gradients and associated methods.
  6. Sung, Chien-Min, Diamond particle mololayer heat spreaders and associated methods.
  7. Chrysler, Gregory M.; Watwe, Abhay A., Electronic assembly with high capacity thermal interface.
  8. Chrysler,Gregory M.; Watwe,Abhay A., Electronic assembly with high capacity thermal interface and methods of manufacture.
  9. Mahajan, Ravi V.; Chrysler, Gregory M., Electronic assembly with high capacity thermal spreader and methods of manufacture.
  10. Gurin,Michael H, Enhanced energy concentrator composition.
  11. Chang,Kuo Ta, Heat dissipating device.
  12. Otsuki,Takaya; Yamaoka,Naoto, Heat dissipating device.
  13. Zhou,Shi Wen; Liu,Peng; Chen,Guo, Heat dissipation device.
  14. Bradenbaugh, Ken A., Heat dissipation device and water heater including the same.
  15. Johnson, Eric Arthur; Stutzman, Randall Joseph, Heat sink for convection cooling in horizontal applications.
  16. Johnson, Eric Arthur; Stutzman, Randall Joseph, Heat sink for convection cooling in horizontal applications.
  17. Sung, Chien-Min, Heat spreader having single layer of diamond particles and associated methods.
  18. Sung, Chien-Min, Heat spreader having single layer of diamond particles and associated methods.
  19. Kuo, Ching-Sung, Heat-dissipating device for electronic components.
  20. Hsieh, Teh-Ming; Tran, Bryan H.; Alipio, Julian A., Heatsink design for uniform heat dissipation.
  21. White, Robert Alvin, In the rate of energy transfer across boundaries.
  22. Ghosh, Prosenjit, Method and apparatus for cooling an electronic component.
  23. Davidson, Howard, Method for bonding substrates.
  24. Swinford, Mark Douglas, Methods for forming a heat exchanger and portions thereof.
  25. Miess, David P.; Vail, Michael A.; McMurray, C. Eugene, Methods of fabricating a polycrystalline diamond body with a sintering aid/infiltrant at least saturated with non-diamond carbon and resultant products such as compacts.
  26. Miess, David P.; Vail, Michael A.; McMurray, C. Eugene, Methods of fabricating a polycrystalline diamond body with a sintering aid/infiltrant at least saturated with non-diamond carbon and resultant products such as compacts.
  27. Miess, David P.; Vail, Michael A.; McMurray, C. Eugene, Methods of fabricating a polycrystalline diamond body with a sintering aid/infiltrant at least saturated with non-diamond carbon and resultant products such as compacts.
  28. Miess, David P.; Vail, Michael A.; McMurray, C. Eugene, Methods of fabricating polycrystalline diamond compacts.
  29. Miess, David P.; Vail, Michael A.; Bertagnolli, Kenneth E.; McMurray, C. Eugene; Jones, Paul Douglas, Methods of making a polycrystalline diamond compact including a polycrystalline diamond table with a thermally-stable region having at least one low-carbon-solubility material.
  30. Jones, Paul Douglas; Bertagnolli, Kenneth E.; Mukhopadhyay, Debkumar; Miess, David P., Methods of manufacturing a polycrystalline diamond compact including a polycrystalline diamond table containing aluminum carbide therein.
  31. Antel, Jr., William Joseph; Diaz, Carlos Enrique; Benignos, Jorge Carretero, Plate-like air-cooled engine surface cooler with fluid channel and varying fin geometry.
  32. Sani, Mohammad N., Polycrystalline diamond compact.
  33. Sani, Mohammad N., Polycrystalline diamond compact.
  34. Sani, Mohammad N., Polycrystalline diamond compact.
  35. Sani, Mohammad N., Polycrystalline diamond compact and method of making same.
  36. Bertagnolli, Kenneth E.; Miess, David P., Polycrystalline diamond compact formed by iniltrating a polycrystalline diamond body with an infiltrant having one or more carbide formers.
  37. Jones, Paul Douglas; Bertagnolli, Kenneth E.; Mukhopadhyay, Debkumar; Miess, David P., Polycrystalline diamond compact including a polycrystalline diamond table containing aluminum carbide therein and applications therefor.
  38. Miess, David P.; Vail, Michael A.; Bertagnolli, Kenneth E.; McMurray, C. Eugene; Jones, Paul Douglas, Polycrystalline diamond compact including a polycrystalline diamond table having copper-containing material therein and applications therefor.
  39. Miess, David P.; Vail, Michael A.; Bertagnolli, Kenneth E.; McMurray, C. Eugene; Jones, Paul Douglas, Polycrystalline diamond compact including a polycrystalline diamond table with a thermally-stable region having a copper-containing material and applications therefor.
  40. Miess, David P.; Vail, Michael A.; Bertagnolli, Kenneth E.; McMurray, C. Eugene; Jones, Paul Douglas, Polycrystalline diamond compact including a polycrystalline diamond table with a thermally-stable region having at least one low-carbon-solubility material and applications therefor.
  41. Sani, Mohammad N., Polycrystalline diamond compact including pre-sintered polycrystalline diamond table having a thermally-stable region and applications therefor.
  42. Sani, Mohammad N., Polycrystalline diamond compact including pre-sintered polycrystalline diamond table having a thermally-stable region and applications therefor.
  43. Sani, Mohammad N., Polycrystalline diamond compacts.
  44. Vail, Michael A., Polycrystalline diamond compacts and applications therefor.
  45. Marceau,Richard J.; Brousseau,R?al; Hall?e,Jacques; Barrette,Danielle; Brouillette,Martin, Portable rest device for laptop computer.
  46. Sung, Chien-Min; Kan, Ming Chi; Hu, Shao Chung, Stress regulated semiconductor devices and associated methods.
  47. Sung, Chien-Min; Kan, Ming-Chi; Hu, Shao Chung, Stress regulated semiconductor devices and associated methods.
  48. Dale, James L., Stud welded pin fin heat sink.
  49. Bertagnolli, Kenneth E., Superabrasive elements, methods of manufacturing, and drill bits including same.
  50. Bertagnolli, Kenneth E.; Miess, David P., Superabrasive elements, methods of manufacturing, and drill bits including same.
  51. Nair, Rajesh; Obinelo, Izundu F., Uniform heat dissipating and cooling heat sink.
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