초록 ▼

A method and apparatus for abatement of effluent from a CVD process using a source reagent having a metal organic loosely bound to a organic or organomettalic molecule such that upon exposure to heat such bond is readily cleavable, e.g., copper deposition process involving the formation of films on

A method and apparatus for abatement of effluent from a CVD process using a source reagent having a metal organic loosely bound to a organic or organomettalic molecule such that upon exposure to heat such bond is readily cleavable, e.g., copper deposition process involving the formation of films on a substrate by metalorganic chemical vapor deposition (CVD) utilizing a precursor composition for such film formation. The abatement process in specific embodiments facilitates high efficiency abatement of effluents from copper deposition processes utilizing Cu(hfac)TMVS as a copper source reagent.

대표청구항 ▼

1. A method for abatement of effluent from a process for depositing copper on a substrate from an organometallic copper source reagent, said method comprising contacting the effluent with a sorbent material having sorptive affinity for said copper source reagent and decomposition products thereof, t

1. A method for abatement of effluent from a process for depositing copper on a substrate from an organometallic copper source reagent, said method comprising contacting the effluent with a sorbent material having sorptive affinity for said copper source reagent and decomposition products thereof, to at least partially remove residual copper source reagent and decomposition products from the effluent, wherein said sorbent material is selected from the group consisting of inorganic sorbent and organic polymer sorbent.