초록 ▼

A heat exchanger and method for cooling power electronics modules. The power electronics module transferring heat generated during operation to the heat exchanger through a thermal base of the power module. The heat exchanger being directly bonded to the thermal base and comprising a metal foam. The

A heat exchanger and method for cooling power electronics modules. The power electronics module transferring heat generated during operation to the heat exchanger through a thermal base of the power module. The heat exchanger being directly bonded to the thermal base and comprising a metal foam. The metal foam having a network of metal ligaments forming numerous open cells to provide porosity. The metal ligaments are aligned to provide a higher metal density in cross-sectional planes of the foam perpendicular to the intended direction of heat flow.

대표청구항 ▼

1. A method of cooling an electronic power module comprising the steps of:(a) providing a block of metal foam in a heat transfer relationship to the module to be cooled, the metal foam having a network of ligaments forming randomly distributed open pores, each of the pores having an approximately sp

1. A method of cooling an electronic power module comprising the steps of:(a) providing a block of metal foam in a heat transfer relationship to the module to be cooled, the metal foam having a network of ligaments forming randomly distributed open pores, each of the pores having an approximately spherical shape which is elongated in a direction orthogonal to a surface of the module; (b) bonding the block to the surface of the module; (c) directing a fluid coolant through the pores of the foam to remove heat in a substantially perpendicular direction to the surface of the module through the network of ligaments.