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Alkanolamine semiconductor process residue removal process 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C11D-007/32
  • C11D-007/50
  • C11D-007/26
출원번호 US-0444548 (1999-11-22)
발명자 / 주소
  • Wai Mun Lee
출원인 / 주소
  • EKC Technology, Inc.
대리인 / 주소
    Pennie & Edmonds, LLP
인용정보 피인용 횟수 : 7  인용 특허 : 63

초록

A two carbon atom linkage alkanolamine compound composition comprises the two carbon atom linkage alkanolamine compound, gallic acid or catechol, and optionally, an aqueous hydroxylamine solution. The balance of the composition is made up of water, preferably high purity deionized water, or another

대표청구항

1. A process for removal of residue from a substrate, which comprises contacting the substrate with a composition comprising:(a) alkanolamine compound selected from the group consisting of monoethanolamine, isopropanolamine, 2-amino-1-propanol, and diglycolamine, (b) a chelating agent (c) an aqueous

이 특허에 인용된 특허 (63)

  1. Pustilnik Cecil S. (Albuquerque NM) Shannon George E. (Albuquerque NM), A process for removing corrosive by-products from a circuit assembly.
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  4. Beechko Nicholas (South Burlington VT), Anisotropic etching method and etchant.
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  7. Lee Wai Mun, Cleaning compositions for removing etching residue and method of using.
  8. Lee Wai Mun, Cleaning compositions for removing etching residue and method of using.
  9. Lee Wai Mun (Fremont CA), Cleaning compositions for removing etching residue with hydroxylamine, alkanolamine, and chelating agent.
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  33. Lee Wai M. (Milpitas CA), Method of stripping resists from substrates using hydroxylamine and alkanolamine.
  34. Muccitelli, John A., Method of utilizing improved stability oxygen scavenger compositions.
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  56. Lee Wai M. (Milpitas CA), Stripping compositions comprising hydroxylamine and alkanolamine.
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  58. Ward Irl E. (Bethlehem PA), Stripping with aqueous composition containing hydroxylamine and an alkanolamine.
  59. Hayashida Ichiro (Kawagoe JPX) Kakizawa Masahiko (Kawagoe JPX) Umekita Kenichi (Kawagoe JPX) Nawa Hiroyoshi (Kawagoe JPX) Muraoka Hisashi (Yokohama JPX), Surface treating cleaning method.
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  61. Lee Wai M. (Milpitas CA), Triamine positive photoresist stripping composition and post-ion implantation baking.
  62. Lee Wai M. (Milpitas CA), Triamine positive photoresist stripping composition and prebaking process.
  63. Zupanovich John D. (Pittsburgh PA) Neil Lois J. (Sewickley PA) Sepelak Dennis J. (McMurray PA), Trihydroxybenzene boiler corrosion inhibitor compositions and method.

이 특허를 인용한 특허 (7)

  1. Lee, Wai Mun, Alkanolamine semiconductor process residue removal composition and process.
  2. Lee,Wai Mun, Cleaning compositions and methods of use thereof.
  3. Lee,Wai Mun; Pittman, Jr.,Charles U.; Small,Robert J., Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials.
  4. Lee,Wai Mun; Pittman, Jr.,Charles U.; Small,Robert J., Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials.
  5. Lee, Wai Mun, Composition and method for treating semiconductor substrate surface.
  6. Lee, Wai Mun, Composition and method for treating semiconductor substrate surface.
  7. Daviot,Jerome; Affrossman,Stanley; Holmes,Douglas, Inhibition of titanium corrosion.
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