초록 ▼

The present invention is directed to an electronic component assembly and method of manufacture which can be efficiently implemented and which reduces the amount of work required to create a plated through-hole for connecting one circuit to another circuit in an electronic component assembly. During

The present invention is directed to an electronic component assembly and method of manufacture which can be efficiently implemented and which reduces the amount of work required to create a plated through-hole for connecting one circuit to another circuit in an electronic component assembly. During electronic component assembly fabrication, at least a portion of an inner core of the electronic component assembly's heat sink assembly is replaced with a dielectric "zone." Once the electronic component assembly is manufactured, connections from one circuit on one side of the electronic component assembly to another circuit on the other side of the electronic component assembly can be achieved using plated through-holes. As such, circuit boards can be connected on opposite sides of the electronic component assembly without having to perform the labor intensive connection of circuits through the use of discrete wires or printed flexes.

대표청구항 ▼

1. An electronic component assembly comprising:at least first and second electrical circuits; and a heat sink assembly connected to said first and second electrical circuits, said heat sink assembly including an inner core having at least a first portion made of a dielectric material having multiple

1. An electronic component assembly comprising:at least first and second electrical circuits; and a heat sink assembly connected to said first and second electrical circuits, said heat sink assembly including an inner core having at least a first portion made of a dielectric material having multiple through-holes from said first electrical circuit to said second electrical circuit, and a second portion surrounding said first portion and made of a material that is different from said dielectric material, wherein the first portion is co-cured with said second portion.