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Folded fin heat sink and fan attachment 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0054271 (1998-04-02)
발명자 / 주소
  • Gregory T. Wyler
  • Peter B. Favini
  • Blaine C. Wotring
  • Bibek Chapagain
출원인 / 주소
  • Silent Systems, Inc.
대리인 / 주소
    Bromberg & Sunstein LLP
인용정보 피인용 횟수 : 51  인용 특허 : 33

초록

A folded fin heat sink to be clamped onto circuit components in need of cooling, in particular CPU's. Ridges are designed to optimize air flow. Suitable for use with a fan to force air movement.

대표청구항 ▼

1. A heat sink comprising:a thermally conductive sheet folded into at least one set of alternating ridges and grooves, said sheet having a bottom formed by at least one of the grooves, wherein said thermally conductive sheet includes openings through a plurality of the ridges on top of said sheet; a

이 특허에 인용된 특허 (33)

  1. Shen Tsan-Jung (3F. ; No. 52 ; Lane 280 ; Min Chuan E. Rd. ; Sec. 6 Taipei TWX), CPU heat dissipating apparatus.
    상세보기
  2. Lee Tzu-I,TWX, CPU heat dissipator.
    상세보기
  3. Lee Richard (10F ; No. 525 ; Chung-Cheng Rd. Hsintien ; Taipei Hsien TWX), CPU heat sink mounting structure.
    상세보기
  4. Campanella Vincent (Wakefield MA) Vasconcelos Osvaldo M. (Milton MA), Clamping heat sink.
    상세보기
  5. Campanella Vincent (Wakefield MA) Vasconcelos Osvaldo M. (Milton MA), Clamping heat sink for an electric device.
    상세보기
  6. Harmon Ronald A. (Hudson MA) Urrata Giovanni (Wakefield MA), Clip for clamping heat sink module to electronic module.
    상세보기
  7. Villani Angelo (Shrewsbury MA), Clip-on heat sink.
    상세보기
  8. Yeh Robin,TWX, Cooling apparatus for a computer central processing unit.
    상세보기
  9. Hatada Toshio (Tsuchiura JPX) Ohashi Shigeo (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Matsushima Hitoshi (Ryugasaki JPX) Sato Motohiro (Ibaraki JPX) Inouye Hiro, Cooling apparatus of electronic device.
    상세보기
  10. Wu Shuenn-Jenq (Taipei TWX), Cooling assembly for an integrated circuit.
    상세보기
  11. Hoover John W. (Huntington CT), Detachable apparatus for cooling integrated circuits.
    상세보기
  12. Kodama Nobumasa (Tokyo JPX) Watanabe Jiro (Tokyo JPX), Electronic component cooling apparatus.
    상세보기
  13. Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Enhanced flow distributor for integrated circuit spot coolers.
    상세보기
  14. Morosas Christopher G. (Sutton MA), Fan driven heat sink.
    상세보기
  15. Kelley Lawrence R., Heat conductive interface material.
    상세보기
  16. Blomquist Michael L. (Newbury Park CA), Heat dissipating assembly.
    상세보기
  17. Lopez Robert R., Heat exchanger.
    상세보기
  18. Paulman Roger (Barrington IL) Wohrstein Franz X. (Park Ridge IL), Heat exchanger assembly with integral fin unit.
    상세보기
  19. Harmon Ronald A. (Hudson MA), Heat sink.
    상세보기
  20. Harmon Ronald A. (Hudson MA) Felps Jimmie D. (Colorado Springs CO), Heat sink device.
    상세보기
  21. Morikawa Fumihiro (Yonago JPX) Saeki Hiroaki (Sakaiminato JPX), Heat sink fan.
    상세보기
  22. Lai Yaw-Huey (Taipei TWX), Heat-dissipating device for a central processing unit chip.
    상세보기
  23. Bailey Norman W. (Sacramento CA), Low profile integrated heat sink and fan assembly.
    상세보기
  24. Schwegler Tim (Pforzheim DEX), Method and apparatus for attaching a heat sink and a fan to an integrated circuit package.
    상세보기
  25. Harmon Ronald A. (Hudson MA) Madan Nanak C. (Lowell MA) Tremblay Donald P. (Nashua NH), Method of and apparatus for forming a unitary heat sink body.
    상세보기
  26. Azar Kaveh (Westwood MA) Caron Richard E. (Salem NH), Narrow channel finned heat sinking for cooling high power electronic components.
    상세보기
  27. Blomquist Michael L. (3474 Carl Ct. Newbury Park CA 91320), Package clip on heat sink.
    상세보기
  28. Bright Edward J. (Middletown PA) Crompton ; III James E. (Pfafftown NC) Taylor Attalee S. (Palmyra PA) Walker Kevin E. (Harrisburg PA), Retainer for securing a heat sink to a socket.
    상세보기
  29. Harmon Ronald A. (Hudson MA), Self clamping heat sink.
    상세보기
  30. Clemens Donald L. (The Colony TX) Mandell Keith (Irving TX), Spring clamp assembly with electrically insulating shoe.
    상세보기
  31. Wieland ; Jr. Howard N. (Holliston MA), Spring clip and heat sink assembly for electronic components.
    상세보기
  32. Morosas Christopher G. (Sutton MA), Spring clip for clamping a heat sink module to an electronic module.
    상세보기
  33. Mok Lawrence S. (Yorktown Heights NY), Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surfa.
    상세보기

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  1. Hanewinkel, III,William H; Williams,Mark G, Aircraft heat sink and electronics enclosure.
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  2. Spokoiny, Michael; Kerner, James M.; Qiu, Xinliang; Lux, Craig J.; Maurus, James W., Airflow heat dissipation device.
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  3. Llapitan,David J.; Tate,Alan W., Captive socket actuator.
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  4. Johnson, Eric C.; Leeds, Michael, Concentrating solar collector.
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  8. Johnson, Eric C.; Leeds, Michael, Dual trough concentrating solar photovoltaic module.
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  9. McHugh, Robert G.; Ma, Hao-Yun, Electrical connector with lever retainer.
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  10. Bird, John; Larson, Ralph I.; North, Lyne Dor?; Bussiere, Paul; Allen, Amy, Electronics cooling subassembly.
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  11. Chang,Yuh Ching; Zhao,Yong Qiang; Cao,Ming Kun, Fan bracket and heat dissipation apparatus incorporating the same.
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  12. Ignomirello, Brian M.; Liang, Suihong, Fast system state cloning.
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  13. Wang, Jack; Cheng, Cheng-Hua; Lin, Michael; Ma, Charles, Fastening structure of heat sink.
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  14. Rong, Guangwei; Duan, Pingsen; Yang, Qing; Han, Weifeng, Fixing device for heat exchanger.
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  15. Spokoiny, Michael; Kerner, James M.; Qiu, Xinliang; Maurus, James W.; Spokoyny, Boris M., Fluid-operated heat transfer device.
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  16. Spokoiny, Michael; Kerner, James M.; Lux, Craig J.; Maurus, James M., Heat dissipating device.
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  17. Upton, Kenneth; Burdy, John, Heat shield having locating and retention features.
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  18. Chiba, Hiroshi; Ogushi, Tetsuro; Yamada, Akira; Yamabuchi, Hiroshi, Heat sink.
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  19. Chiba,Hiroshi; Ogushi,Tetsuro; Yamada,Akira; Yamabuchi,Hiroshi, Heat sink.
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  20. Liu, HeBen, Heat sink assembly with embedded fan.
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  21. Taban, Vahid, Heat sink having folded fin heat exchanger core.
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  22. Sun, Ke; Chen, Xiao Zhu, Heat sink having high heat dissipation efficiency.
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  23. Sasaki, Chiyoshi; Sotani, Junji; Ohmi, Masaru; Hama, Toshikatsu; Ootori, Yasuhiro, Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin.
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  24. Wang, Fang; Sin Yan Too, Thierry; Moore, Jim; Hu, Mong, Heatsink mounting system.
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  25. Hsu, Li, Integrated snap and handling feature.
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  26. Li, Hsu, Integrated snap and handling feature.
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  27. Zrodnikov, Volodymyr; Spokoyny, Mikhail, Interlocked jets cooling method and apparatus.
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  33. McLeod, Gary; Li, I-Chyau, Mechanisms and techniques for fastening a heat sink to a circuit board component.
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  34. Ignomirello, Brian M., Method and apparatus for dense hyper IO digital retention.
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  35. Ignomirello, Brian M., Method and apparatus for dense hyper IO digital retention.
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  36. Ignomirello, Brian M., Method and apparatus for dense hyper IO digital retention.
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  37. Zrodnikov, Volodymyr; Kerner, James M.; Spokoiny, Michael, Method for conditioning a cooling loop of a heat exchange system.
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  38. Nguyen,Nguyen Tu; Dang,Long Huu; Seyed,Saeed, Methods and apparatus for fastening a set of heatsinks to a circuit board.
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  39. Johnson, Eric C.; Leeds, Michael; Woodard, Nathan, Photovoltaic receiver.
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  40. Yoshioka,Jun; Sasaki,Kiyoshi; Satoh,Johji, Plate fin for heat exchanger and heat exchanger core.
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  41. Steger, Jürgen; Ebersberger, Frank, Pressure-contact power semiconductor module and method for producing the same.
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  42. Cheng, Jui-Hung, Radiator fan.
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  43. Lee, Tzung-Lung, Radiator fin formed by sintering operation.
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  44. Rogers, C. James; Hughes, Gregory G.; Zhang, L. Winston; Grippe, Frank M.; Cheema, Rifaquat, Serpentine, slit fin heat sink device.
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  45. Johnson, Eric C.; Bilodeau, James L.; Wells, Jason R.; Nightingale, John L.; Finot, Marc A., Solar collector with end modifications.
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  46. Do, Khiem B.; Langworthy, Kevin R.; Gabbianelli, Gianfranco; Johnson, Eric C.; Julian, Dominico P.; Finot, Marc A.; Wylie, Cameron G., Solar energy collection system.
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  47. Nguyen,Toan; Chern,Michael; Seyed,Saeed, Techniques for attaching a heat sink assembly to a circuit board component.
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  48. Liang,Hsing Sheng; Sya,George; Huynh,Hong; Koken,Michael; Chern,Michael; Fang,Yuan Cheng, Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board.
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  49. Sya,George; Huynh,Hong; Koken,Michael, Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board.
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  50. Ignomirello, Brian M., Tray.
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  51. Lehman, Bret W.; Loebach, Beth Frayne; Makley, Albert Vincent; Matteson, Jason Aaron, Vibration isolation of computing device heat sink fans from attached fan shrouds and heat sinks.
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