$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Circuit encapsulation 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B29C-045/02
  • B29C-045/14
출원번호 US-0337581 (1999-06-22)
발명자 / 주소
  • John R. Saxelby, Jr.
  • Walter R. Hedlund, III
출원인 / 주소
  • VLT Corporation
대리인 / 주소
    Fish & Richardson P.C.
인용정보 피인용 횟수 : 29  인용 특허 : 42

초록 ▼

A circuit on a circuit board is encapsulated using a first mold section and a second mold section. The first mold section closes on one side of the board, and the first mold section has an exposed first conduit. The second mold section closes on another side of the board, and the second mold section

대표청구항 ▼

1. A method for encapsulating a circuit on a circuit board, comprising:closing a first mold section on one side of the board, the first mold section having an exposed cylinder; closing a second mold section on another side of the board, the second mold section having a conduit for pushing molding co

이 특허에 인용된 특허 (42)

  1. Chou C. H. (Taipei TWX) Wang T. H. (Taipei Hsien TWX) Chen C. S. (Taipei Hsien TWX), Air exhaust mold plunger.
    상세보기
  2. Moitzger Max (Lodi CA), Apparatus for encapsulating selected portions of a printed circuit board.
    상세보기
  3. De\Ath Roderick M. (Oxfordshire GB2), Apparatus for injection moulding.
    상세보기
  4. Shaheen Joseph M. (La Habra CA), Ceramic/organic multilayer interconnection board.
    상세보기
  5. Derryberry Lesli A. (Dallas TX) Williams Charles E. (Dallas TX), Circuit board with a chip carrier and mounting structure connected to the chip carrier.
    상세보기
  6. Leatham James G. (Redondo Beach CA), Circuit package attachment apparatus and method.
    상세보기
  7. Kaufman Lance R. (131 White Oak Way Mequon WI 53092), Compact circuit package having improved circuit connectors.
    상세보기
  8. Fierkens Richard H. J. (Keurbeck 15 6914 Ae Herwen NLX), Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device.
    상세보기
  9. Bartley John E. (Greenfield WI) Penrod Orville R. (Kernersville NC), Edge termination for an electrical circuit device.
    상세보기
  10. Yamamoto Masato (Imari JPX), Electric device with an operation indicating lamp.
    상세보기
  11. Knoll Carl G. (Melrose Park IL), Electrical terminal constructed to prevent insert molding flash.
    상세보기
  12. Baird John (Scottsdale AZ), Encapsulation means and method for reducing flash.
    상세보기
  13. Neugebauer Constantine A. (Schenectady NY) Satriano Robert J. (Hackettstown NJ) Burgess James F. (Schenectady NY) Glascock ; II Homer H. (Scotia NY) Temple Victor A. K. (Clifton Park NY) Watrous Dona, High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip.
    상세보기
  14. Wojnarowski Robert J. (Ballston Lake NY) Eichelberger Charles W. (Schenectady NY) Kornrumpf William P. (Albany NY), High density interconnect structure including a chamber.
    상세보기
  15. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY), High density interconnect with high volumetric efficiency.
    상세보기
  16. Boucard Michel (Tournefeuille FRX) Thirion Christian (Auterive FRX) Maurel Christian (Toulouse FRX), Housing for an electronic circuit.
    상세보기
  17. Werther William E. (Glen Cove NY), Interconnection package suitable for electronic devices and methods for producing same.
    상세보기
  18. Gilbert, Barry K.; Schwab, Daniel J., Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation.
    상세보기
  19. Gilbert, Barry K.; Schwab, Daniel J., Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation.
    상세보기
  20. Benenati Robert (Tamarac FL) Desjardins Joseph (Tamarac FL) Mitzlaff James E. (Carpentersville IL) Beutler Scott D. (Des Plaines IL) Albert Mike M. (Chicago IL) Brown Vernon L. (Barrington IL), Leadless chip carrier for RF power transistors or the like.
    상세보기
  21. Kaufman Lance R. (131 N. White Oak Way Mequon WI 53092), Low cost compressively clamped circuit and heat sink assembly.
    상세보기
  22. Hamada Makoto (Tokyo JPX) Ise Hiroshi (Tokyo JPX), Metal mold for sealing semiconductor devices with a resin.
    상세보기
  23. McShane Michael B. (Austin TX) Woosley Alan H. (Austin TX) Primeaux Francis (Austin TX), Method for encapsulating semiconductor devices with package bodies.
    상세보기
  24. Goo Lee (Seoul KRX), Method for molding of integrated circuit package.
    상세보기
  25. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY) Welles ; II Kenneth B. (Schenectady NY), Method for packaging integrated circuit chips employing a polymer film overlay layer.
    상세보기
  26. Heft Josef (Munich DEX), Method for producing electrical connection with a ribbon cable.
    상세보기
  27. Leeb Karl-Erik (Djurhamn SEX), Method of manufacturing circuit board having lateral conductive pattern.
    상세보기
  28. Arai Yasunari (Tokyo JPX) Hamano Hiroshi (Kawasaki JPX) Amemiya Izumi (Yokohama JPX) Yamamoto Takuji (Kawasaki JPX) Ihara Takeshi (Kawasaki JPX), Method of producing an electronic circuit package.
    상세보기
  29. Chia Chok J. (Santa Clara CA), Molded pin grid array package GPT.
    상세보기
  30. Sakai Kunito (Hyogo JPX) Oshio Kazuharu (Hyogo JPX) Kanegae Hirozoh (Hyogo JPX), Molding machine and method.
    상세보기
  31. Wolf Franz-Josef (Bad Soden Salmunster DEX), Molding tool.
    상세보기
  32. Shimada Yuzo (Tokyo JPX) Kurokawa Yasuhiro (Tokyo JPX) Utsumi Kazuaki (Tokyo JPX), Multi-layer circuit board having a large heat dissipation.
    상세보기
  33. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY), Multichip integrated circuit packaging configuration and method.
    상세보기
  34. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY), Multichip integrated circuit packaging method.
    상세보기
  35. Kaufman, Lance R., Multiple substrate circuit package.
    상세보기
  36. Vinciarelli Patrizio (Boston MA) Finnemore Fred (No. Reading MA) Balog John S. (Mendon MA) Johnson Brant T. (Concord MA), Packaging electrical components.
    상세보기
  37. Carlson Randolph S. (Carson City NV) Chase Charles P. (Carson City NV), Packaging system for stacking integrated circuits.
    상세보기
  38. Chia Chok J. (Santa Clara CA), Plastic molded pin-grid-array power package.
    상세보기
  39. Morris James B. (Bloomington MN), Process for assembling integrated circuit packages.
    상세보기
  40. Konishi Akira (Kyoto JPX) Wakano Teruo (Kyoto JPX), Semiconductor device and its manufacture.
    상세보기
  41. Mennitt Timothy J. (Cedar Park TX) Warren John P. (Austin TX) Sloan James W. (Austin TX), Semiconductor device with test-only contacts and method for making the same.
    상세보기
  42. Calver John G. (Rochester NY) Pearce Phillip W. (Pavilion NY) Zielinski Erich (Bergen NY), Semiconductor mounting assembly.
    상세보기

이 특허를 인용한 특허 (29)

  1. Karmazyn, Michael J., Angular encapsulation of tandem stacked printed circuit boards.
    상세보기
  2. Vinciarelli, Patrizio; LaFleur, Michael B.; Fleming, Sean Timothy; Mutter, Rudolph F.; D'Amico, Andrew T., Encapsulated modular power converter with symmetric heat distribution.
    상세보기
  3. Vinciarelli, Patrizio, Encapsulation method and apparatus for electronic modules.
    상세보기
  4. Vinciarelli, Patrizio; LaFleur, Michael B., Encapsulation method and apparatus for electronic modules.
    상세보기
  5. Vinciarelli, Patrizio; LaFleur, Michael B., Encapsulation method for electronic modules.
    상세보기
  6. Mori,Haruhiko; Kanakubo,Masaru; Sakamoto,Hideyuki, Hybrid integrated circuit device and method of manufacturing the same.
    상세보기
  7. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  8. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  9. Low, Jeffrey Khai Huat; Lee, Kean Cheong, Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component.
    상세보기
  10. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  11. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  12. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  13. Ahmad, Syed Sajid, Method of Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  14. Vinciarelli, Patrizio; Lavery, Patrick R.; Mutter, Rudolph F.; Kirk, Jeffery J.; D'Amico, Andrew T., Method of electrically interconnecting circuit assemblies.
    상세보기
  15. Cobbley,Chad A., Method of encapsulating interconnecting units in packaged microelectronic devices.
    상세보기
  16. Cobbley,Chad A., Method of encapsulating packaged microelectronic devices with a barrier.
    상세보기
  17. Vinciarelli, Patrizio; Balcius, Robert Joseph; Sadler, Steven P.; Thompson, Mark Andrew, Method of forming an electrical connection to an electronic module.
    상세보기
  18. Vinciarelli, Patrizio; Lafleur, Michael B.; Fleming, Sean Timothy; Mutter, Rudolph; D'Amico, Andrew T., Method of forming an electrical contact.
    상세보기
  19. Vinciarelli, Patrizio; LaFleur, Michael B.; Fleming, Sean Timothy; Mutter, Rudolph F.; D'Amico, Andrew T., Method of making a plurality of electronic assemblies.
    상세보기
  20. Bolken, Todd O., Microelectronic devices and microelectronic die packages.
    상세보기
  21. Cobbley, Chad A., Packaged microelectronic devices with interconnecting units.
    상세보기
  22. James, Stephen L.; Cobbley, Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
    상세보기
  23. James,Stephen L.; Cobbley,Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
    상세보기
  24. Vinciarelli, Patrizio; LaFleur, Michael B.; Fleming, Sean Timothy; Mutter, Rudolph F.; D'Amico, Andrew T., Panel-molded electronic assemblies.
    상세보기
  25. Vinciarelli, Patrizio, Power adapter packaging.
    상세보기
  26. Vinciarelli, Patrizio; LaFleur, Michael B.; McCauley, Charles I.; Starenas, Paul V., Power converter package and thermal management.
    상세보기
  27. Vinciarelli,Patrizio; Lafleur,Michael B.; McCauley,Charles I.; Starenas,Paul V., Power converter package and thermal management.
    상세보기
  28. Vinciarelli, Patrizio; Lafleur, Michael B., System and apparatus for efficient heat removal from heat-generating electronic modules.
    상세보기
  29. Farnworth, Warren M., Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로