초록 ▼

An improved process for forming devices utilizing patterned organic semiconductor films is provided. The process involves treating a surface to selectively provide regions of greater affinity and lesser affinity for an organic semiconductor or an organic semiconductor solution. When the organic semi

An improved process for forming devices utilizing patterned organic semiconductor films is provided. The process involves treating a surface to selectively provide regions of greater affinity and lesser affinity for an organic semiconductor or an organic semiconductor solution. When the organic semiconductor, or solution comprising the semiconductor, is deposited on the treated surface, either the organic semiconductor or the organic semiconductor solution dewets from the lesser affinity regions or the resultant film adheres only weakly to the lesser affinity regions such that selective removal is readily performed. And even where such removal is not performed, the portions of the organic semiconductor film overlying the greater affinity regions exhibit higher mobility and better film continuity relative to the other portions of the film.

대표청구항 ▼

1. A process for fabricating a device, comprising the steps of:providing a surface; treating the surface to selectively provide at least one region of greater affinity for an organic semiconductor or an organic semiconductor solution and at least one region of lesser affinity for the organic semicon

1. A process for fabricating a device, comprising the steps of:providing a surface; treating the surface to selectively provide at least one region of greater affinity for an organic semiconductor or an organic semiconductor solution and at least one region of lesser affinity for the organic semiconductor or the organic semiconductor solution; and forming on the treated surface an organic semiconductor film from the organic semiconductor or the organic semiconductor solution.