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Liquid-cooled electronic apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0235498 (1999-01-22)
우선권정보 JP-0226906 (1998-08-11)
발명자 / 주소
  • Junichi Ishimine JP
  • Masahiro Suzuki JP
  • Masahiro Miyo JP
  • Akihiko Fujisaki JP
  • Keizo Takemura JP
  • Jie Wie JP
  • Hisashi Kawashima JP
  • Yoshiaki Udagawa JP
  • Haruhiko Yamamoto JP
  • Masahiro Mochi
출원인 / 주소
  • Fujitsu Limited JP
대리인 / 주소
    Armstrong, Westerman, Hattori, McLeland & Naughton, LLP
인용정보 피인용 횟수 : 25  인용 특허 : 9

초록

An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-ch

대표청구항

1. An electronic apparatus comprising a motherboard, a number of multi-chip modules mounted to said motherboard, a plurality of cooling members corresponding in number to the number of modules for cooling said multi-chip modules, a refrigeration unit circulating cooling medium for cooling said cooli

이 특허에 인용된 특허 (9)

  1. Ashiwake Noriyuki (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki JPX) Sasaki Shigeyuki (Ibaraki JPX) Ohsone Yasuo (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Iino Toshiki (Ibaraki JPX) Kasai Kenichi (, Apparatus for cooling semiconductor device and computer having the same.
  2. Goth Gary F. ; Loparco John J., Center feed parallel flow cold plate for dual refrigeration systems.
  3. Karpman Maurice S. (Westwood MA), Circuit board thermal contact device.
  4. Chrysler Gregory M.. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.
  5. Wessely Herrmann (Munich DEX), Cooling subrack for logic cards.
  6. Ohashi Shigeo (Tsuchiura JPX) Hatada Toshio (Tsuchiura JPX) Tanaka Takeo (Minori-machi JPX) Iwai Susumu (Hadano JPX), Electronic equipment and lap-top type electronic equipment.
  7. Kucharek Andrzej (Mountain View CA), High density multi-chip interconnection and cooling package.
  8. Morrison Robert A. (Long Beach CA), Hydraulic thermal clamp for electronic modules.
  9. Nam Sang Sig,KRX ; Kwak Ho Young,KRX ; Kim Jae Hee,KRX, Multi chip module cooling apparatus.

이 특허를 인용한 특허 (25)

  1. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
  3. Belady,Christian L.; Womack,Christopher C., Cam actuated cold plate.
  4. Manole, Dan M., Compact refrigeration system and power supply unit including dynamic insulation.
  5. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  6. Nakahama,Takafumi; Kijima,Kenji, Cooling device for heat-generating elements.
  7. Nakahama,Takafumi; Kijima,Kenji, Cooling device for heat-generating elements.
  8. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  9. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
  10. Hotta, Daichi; Neho, Yasushi; Kondo, Yuichi; Saitou, Kenichi; Minamitani, Rintaro; Ohashi, Shigeo, Electronic device, liquid cooling system and tank.
  11. Vos,David L.; Stutzman,Randall J.; Larcheveque,Jon; Urda,Eugene J., Flow through cooling assemblies for conduction-cooled circuit modules.
  12. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  13. Seki, Hideki, Information processing blade and information processing apparatus using the same.
  14. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  15. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
  16. Cepeda Rizo,Juan; Esmailpour,Mohsen; Teneketges,Nicholas J., Liquid immersion cooled multichip module.
  17. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Liquid-based cooling apparatus for an electronics rack.
  18. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  19. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
  20. Cader,Tahir; Ressa,Robert J., Low momentum loss fluid manifold system.
  21. Elison, Bret P.; Mann, Phillip V.; Moore, Arden L.; Sinha, Arvind K., Method for containing computer system components.
  22. Nagashima, Kenichi; Nakagawa, Tsuyoshi; Saito, Kenichi, Method of controlling cooling system for a personal computer and personal computer.
  23. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
  24. Kowalski, Bobby Jim; Denny, Ronald R.; Seward, James T.; Ebsen, Michael P.; Rosenthal, Thomas; Leinberger, William J.; Josephson, Andrew D.; Young, Jeffery Stagg, System and method for interconnecting circuit boards.
  25. Wu, Xin-Yi; Chou, Jui-Chih; Shen, Hsuan-Jen, Temperature control module for a socket.
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