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Methods for wafer to wafer bonding using microstructures

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B81C-001/00
출원번호 US-0324342 (1999-06-02)
발명자 / 주소
  • Vladimir I. Vaganov
출원인 / 주소
  • MegaSense, Inc.
대리인 / 주소
    Skjerven Morrill MacPherson LLP
인용정보 피인용 횟수 : 83  인용 특허 : 12

초록

Wafer-to-wafer bonding using, e.g., solder metal bonding, glass bonding or polymer (adhesive) bonding is improved by profiling one or both of the wafer surfaces being bonded to define microstructures therein. Profiling means providing other than the conventional planar bonding surface to define cavi

대표청구항

1. A method of bonding substrates, comprising the acts of:etching at least a portion of a principal surface of a first crystalline substrate to define therein at least one microstructure, the microstructure defining at least one cavity; bonding with a bonding material the etched portion of the princ

이 특허에 인용된 특허 (12)

  1. Frater Norman Kermit ; Ruiz Oscar Jaime, Adhesively attached hard disk head suspension and etching process.
  2. Ismail M. Salleh ; Garabedian Raffi M. ; Nielsen Max E. ; Pashby Gary J. ; Wong Jeffrey K. K., Fusion-bond electrical feed-through.
  3. Nelson Richard D., Ink jet printhead with improved adhesive bonding between channel and heater substrates.
  4. Nied Herman F. (Clifton Park NY) Mehan Richard L. (Scotia NY), Metal-ceramic structure with intermediate high temperature reaction barrier layer.
  5. Shimada Yasuhiro,JPX ; Yamazaki Takeo,JPX, Method of forming a projection having a micro-aperture, projection formed thereby, probe having such a projection and information processor comprising such a probe.
  6. Ahn Kun-Young (Daejeon KRX) Park Kyung-Ho (Daejeon KRX) Nam Kee-Soo (Daejeon KRX) Kang Sang-Won (Daejeon KRX), Method of manufacturing microstructure by the anisotropic etching and bonding of substrates.
  7. Burke Cathie J. (Rochester NY) Hawkins William G. (Webster NY) Hermanson Herman A. (Penfield NY) Ferringer Michael C. (Ontario NY) Fisher Almon P. (Rochester NY) Atkinson Diane (Webster NY), Micro-electromechanical die module with planarized thick film layer.
  8. Chong John M. ; Adams Scott G. ; MacDonald Noel C. ; Shaw Kevin A., Microfabrication process for enclosed microstructures.
  9. Cho Dong-Il,KRX ; Lee Sangwoo,KRX ; Park Sangjun,KRX, Micromechanical system fabrication method using (111) single crystalline silicon.
  10. Spencer ; Andrew R., Porous laminate and method of manufacture.
  11. Craig Stephen R., Structure for capturing express transient liquid phase during diffusion bonding of planar devices.
  12. Bruel Michel,FRX, Structure having cavities and process for producing such a structure.

이 특허를 인용한 특허 (83)

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  5. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
  6. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
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  8. Ned, Alexander A.; VanDeWeert, Joseph R.; Geras, Leo, Flat covered leadless pressure sensor assemblies suitable for operation in extreme environments.
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  11. Tom, Dennis W.; Hernandez, Juan J., Fluid ejection device.
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  13. Kim, Sarah E.; List, R. Scott; Maveety, James G.; Myers, Alan M.; Vu, Quat T., Integrated re-combiner for electroosmotic pumps using porous frits.
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  21. Eldridge, Benjamin N.; Wenzel, Stuart W., Method for forming microelectronic spring structures on a substrate.
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  31. Kirby, Kyle K., Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods.
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  71. Lee, Dong Keun, Solar battery and method for manufacturing the same.
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  77. Watkins, Charles M.; Hiatt, William M., Systems and methods for forming apertures in microfeature workpieces.
  78. Morford, Chris L., Systems and methods for forming data storage devices.
  79. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
  80. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
  81. Akram, Salman; Watkins, Charles M.; Hiatt, William M.; Hembree, David R.; Wark, James M.; Farnworth, Warren M.; Tuttle, Mark E.; Rigg, Sidney B.; Oliver, Steven D.; Kirby, Kyle K.; Wood, Alan G.; Velicky, Lu, Through-wafer interconnects for photoimager and memory wafers.
  82. Chen, Kuan-Wei; Tzeng, Pei-Jer; Chen, Chien-Chou; Chang, Po-Chih, Wafer bonding method and device with reduced thermal expansion.
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