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Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0675055 (2000-09-29)
발명자 / 주소
  • Michael Z. Eckblad
  • Pardeep K. Bhatti
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Antonelli, Terry, Stout & Kraus, LLP
인용정보 피인용 횟수 : 160  인용 특허 : 7

초록

A heat spreader, method of making the heat spreader, and incorporation of the heat spreader in an assembly such as an electronic assembly, are disclosed. The heat spreader includes a matrix material, which has incorporated therein carbon nanotubes and/or thermal pyrolytic graphite flakes. The carbon

대표청구항

1. A heat spreader, comprising:a matrix material; and at least one of carbon nanotubes and thermal pyrolytic graphite flakes distributed through the matrix material, wherein the heat spreader has a first surface adapted to be in contact with a source of heat a second surface opposed to the first sur

이 특허에 인용된 특허 (7)

  1. Giannetti William B. (Fall River MA) Hess David G. (Atkinson NH) McCord Stuart J. (Westford MA) Rudd ; III Robert E. (Vergennes VT) Shih Wei-Tei (Yorba Linda CA), Composite enclosure for electronic hardware.
  2. Ali M. Akbar ; Peterson Carl W. ; McNab Kevin M., Electronic structure having an embedded pyrolytic graphite heat sink material.
  3. Hoover Ronald E. ; Hutchins Robert S. ; Marble Stuart J. ; Saito Clark A. ; Valle Manuel B., Flexible graphite fiber thermal shunt.
  4. Richey ; III Joseph B., Flexible heat transfer device and method.
  5. Banks Bruce A. (Olmsted Township ; Cuyahoga County OH) Gaier James R. (Strongsville OH), Heat transfer device.
  6. Schmidt Detlef ; Pais Martin R., Hybrid substrate for cooling an electronic component.
  7. Nolan Peter E. ; Cutler Andrew H. ; Lynch David G., Method for producing encapsulated nanoparticles and carbon nanotubes using catalytic disproportionation of carbon monoxi.

이 특허를 인용한 특허 (160)

  1. Zhan,Guodong; Kuntz,Joshua D.; Mukherjee,Amiya K., Anisotropic thermal and electrical applications of composites of ceramics and carbon nanotubes.
  2. Zhan, Guodong; Kuntz, Joshua D.; Mukherjee, Amiya K., Anisotropic thermal applications of composites of ceramics and carbon nanotubes.
  3. Suhir,Ephraim, Apparatus for attaching a cooling structure to an integrated circuit.
  4. Wayman, Michael J., Apparatus for directing heat to a heat spreader.
  5. Wayman, Michael J., Apparatus for spreading heat over a finned surface.
  6. Wayman, Michael J.; Nelson, Michael J., Apparatus for transferring heat from a heat spreader.
  7. Wayman, Michael J.; Nelson, Michael J., Apparatus for transferring heat in a fin of a heat sink.
  8. Nikkhoo, Michael, Bonded multi-layer graphite heat pipe.
  9. Sayir,Haluk; Mariner,John Thomas, Bulk high thermal conductivity feedstock and method of making thereof.
  10. Nikkhoo, Michael; Hurbi, Erin, Carbon nanoparticle infused optical mount.
  11. Brewer, Peter D.; Hunter, Andrew T., Carbon nanotube array interface material and methods.
  12. Guo, Hai-Zhou; Dai, Feng-Wei; Yao, Yuan; Chang, Chang-Shen; Liu, Chang-Hong; Jiang, Kai-Li, Carbon nanotube composite preform and method for making the same.
  13. Hendricks,Terry Joseph; Heben,Michael J., Carbon nanotube heat-exchange systems.
  14. Li,Jun; Meyyappan,Meyya, Carbon nanotube interconnect.
  15. Montgomery, Stephen W.; Holalkere, Ven R., Carbon nanotube thermal interface structures.
  16. Boday, Dylan J.; Kuczynski, Joseph; Meyer, Robert E., Chip stack with oleic acid-aligned nanotubes in thermal interface material.
  17. Dubin,Valery M., Composite carbon nanotube thermal interface device.
  18. Hu,Xuejiao; Jiang,Linan; Goodson,Kenneth E., Composite thermal interface material including particles and nanofibers.
  19. Kuczynski, Joseph; Mikhail, Amanda E.; Moore, Arden L., Composites comprised of aligned carbon fibers in chain-aligned polymer binder.
  20. Chiou, Kuo-Chan; Lee, Tzong-Ming, Composition for thermal interface material.
  21. Ingram,Jason W., Conductive heat transfer system and method for integrated circuits.
  22. Elkovitch,Mark; Ghosh,Soumyadeb; Mutha,Nitin; Rajagopalan,Srinivasan; Ting,Sai Pei, Conductive thermoplastic compositions, methods of manufacture and articles derived from such compositions.
  23. Searby,Tom J., Cooling apparatus for electronic devices.
  24. Schulz-Harder, Jurgen; Hammel, Ernst, Device with a heat source formed by a function element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink.
  25. Sung, Chien-Min, Diamond particle mololayer heat spreaders and associated methods.
  26. Scott, Tim; White, Tamara; Li, Jianxing, Discontinuous high-modulus fiber metal matrix composite for thermal management applications.
  27. Shives,Gary D.; Hoffert,Gerald; Varela,William, Display device.
  28. Shives, Gary D.; Hoffert, Gerald; Varela, William, Display device having improved properties.
  29. Shives, Gary D.; Hoffert, Gerald; Varela, William, Display device having improved properties.
  30. Charati,Sanjay Gurbasappa; Dhara,Dibakar; Elkovitch,Mark; Ghosh,Soumyadeb; Mutha,Nitin; Rajagopalan,Srinivasan; Shaikh,Abbas Alli, Electrically conductive compositions and method of manufacture thereof.
  31. Charati,Sanjay Gurbasappa; Dhara,Dibakar; Ghosh,Soumyadeb; Mutha,Nitin; Rajagopalan,Srinivasan; Shaikh,Abbas Alli; Elkovitch,Mark D., Electrically conductive compositions and method of manufacture thereof.
  32. Keulen,Jan Peter; Koevoets,Christiaan Henricus Johannes, Electrically conductive compositions and method of manufacture thereof.
  33. Arik, Mehmet; Weaver, Jr., Stanton E.; Carnahan, James C.; Becker, Charles A.; Gerstler, William D., Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking.
  34. Cola, Baratunde A.; Fisher, Timothy S., Electrothermal interface material enhancer.
  35. Hedrick, James L.; Miller, Robert Dennis; Neumayer, Deborah Ann; Purushothaman, Sampath; Rothwell, Mary E.; Volksen, Willi; Yu, Roy R., Enhanced adhesive materials and processes for 3D applications.
  36. Kilroy, Kevin Donald; Miller, Darren L.; Wavering, Jeffrey T., Flexible thermal transfer strips.
  37. Wang, Jack; Cheng, Cheng-Hua; Lin, Michael; Ma, Charles, Heat dissipating device for a CPU.
  38. Ghantiwala, Nayana V., Heat sink.
  39. Ghantiwala, Nayana V., Heat sink.
  40. Leu,Charles; Yu,Tai Cherng; Chen,Ga Lanee; Lin,Jyh Chain, Heat sink with carbon nanotubes and method for manufacturing same.
  41. Lemak, Richard J.; Rao, V. N. Padmanabha, Heat spreader and method of making the same.
  42. Lemak, Richard James; Rao, V. N. Padmanabha, Heat spreader and method of making the same.
  43. Capp,Joseph P.; Clovesko,Timothy; Norley,Julian; Smalc,Martin David; Reis,Bradley E., Heat spreader for display device.
  44. Capp,Joseph P.; Clovesko,Timothy; Norley,Julian; Smalc,Martin David; Reis,Bradley E., Heat spreader for display device.
  45. Clovesko,Timothy; Norley,Julian; Smalc,Martin David; Capp,Joseph Paul, Heat spreader for display device.
  46. Smalc, Martin David; Norley, Julian; Capp, Joseph Paul; Clovesko, Timothy, Heat spreader for display panel.
  47. Clovesko, Timothy; Norley, Julian; Smalc, Martin David; Capp, Joseph Paul, Heat spreader for emissive display device.
  48. Clovesko,Timothy; Norley,Julian; Smalc,Martin David; Capp,Joseph Paul, Heat spreader for emissive display device.
  49. Norley, Julian; Smalc, Martin David; Capp, Joseph Paul; Clovesko, Timothy, Heat spreader for plasma display panel.
  50. Norley, Julian; Smalc, Martin David; Capp, Joseph Paul; Clovesko, Timothy, Heat spreader for plasma display panel.
  51. Sung, Chien-Min, Heat spreader having single layer of diamond particles and associated methods.
  52. Sung, Chien-Min, Heat spreader having single layer of diamond particles and associated methods.
  53. Hashimoto, Mitsuo; Yazawa, Kazuaki; Ishida, Yuichi; Ryoson, Hiroyuki, Heat spreader, electronic apparatus, and heat spreader manufacturing method.
  54. Hashimoto, Mitsuo; Yazawa, Kazuaki; Ishida, Yuichi; Ryoson, Hiroyuki, Heat spreader, electronic apparatus, and heat spreader manufacturing method.
  55. Tantolin, Christian; Sarno, Claude, Heat transfer device including compressible particles suspended in a circulating heat-transfer fluid.
  56. Basavanhally,Nagesh R; Cirelli,Raymond A; Lopez,Omar Daniel, High density nanostructured interconnection.
  57. Basavanhally,Nagesh R; Cirelli,Raymond A; Lopez,Omar Daniel, High density nanostructured interconnection.
  58. Dando, III, Charles H.; Larcheveque, Jon; Vos, David L., High performance large tolerance heat sink.
  59. Bartley, Gerald K.; Johnson, Charles L.; Kelly, III, John E.; Kuczynski, Joseph; Motschman, David R.; Sinha, Arvind K; Splittstoesser, Kevin A.; Tofil, Timothy A., Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance.
  60. Bartley, Gerald K.; Johnson, Charles L.; Kelly, III, John E.; Kuczynski, Joseph; Motschman, David R.; Sinha, Arvind K.; Splittstoesser, Kevin A.; Tofil, Timothy J., Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks.
  61. Dangelo, Carlos; Padmakumar, Bala, In-chip structures and methods for removing heat from integrated circuits.
  62. De Lorenzo, David S.; Montgomery, Stephen W.; Fite, Robert J., Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD.
  63. Dangelo, Carlos; Olson, Darin, Integrated circuit micro-cooler having multi-layers of tubes of a CNT array.
  64. Wyland, Chris, Integrated circuit nanotube-based subsrate.
  65. Leu,Charles; Yu,Tai Cherng; Huang,Chuan De; Huang,Wen Jeng; Lin,Jhy Chain; Chen,Ga Lane, Integrated circuit package with carbon nanotube array heat conductor.
  66. Bish, Jack; Hanrahan, Kevin; Brink, Damon, Integrated heat spreader lid.
  67. Basavanhally, Nagesh R.; Cirelli, Raymond A.; Lopez, Omar D., Interconnect including a pliable surface and use thereof.
  68. Bauer, Michael; Haimerl, Alfred; Hosseini, Khalil; Kessler, Angela; Mahler, Joachim; Schober, Wolfgang, Layer between interfaces of different components in semiconductor devices.
  69. Lemak, Richard James; Rao, V. N. P., Layered heat spreader and method of making the same.
  70. Nikkhoo, Michael; Hurbi, Erin, Metal encased graphite layer heat pipe.
  71. Ng,Hou Tee; Li,Jun; Meyyappan,Meyya, Metallic nanowire interconnections for integrated circuit fabrication.
  72. Suhir, Ephraim; Xu, Yuan; Zhang, Yi, Method and apparatus for evaluation and improvement of mechanical and thermal properties of CNT/CNF arrays.
  73. Montgomery, Stephen W.; Aldridge, Tomm V., Method and apparatus for producing aligned carbon nanotube thermal interface structure.
  74. Montgomery, Stephen W.; Aldridge, Tomm V., Method and apparatus for producing aligned carbon nanotube thermal interface structure.
  75. Searls, Damion T.; Dishongh, Terrance J.; Jackson, James Daniel, Method and apparatus using nanotubes for cooling and grounding die.
  76. Kuczynski, Joseph; Sinha, Arvind Kumar; Splittstoesser, Kevin Albert; Tofil, Timothy Jerome, Method and system for allignment of graphite nanofibers for enhanced thermal interface material performance.
  77. Boday, Dylan J.; Kuczynski, Joseph; Meyer, III, Robert E., Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field.
  78. Huang,Hua; Wu,Yang; Liu,Chang Hong; Fan,Shou Shan, Method for making a thermal interface material.
  79. Yao, Yuan; Dai, Feng-Wei; Wang, Ji-Cun; Zhang, Hui-Ling; Wang, You-Sen; Liu, Chang-Hong, Method for making thermal interface material.
  80. Hsiao,Bor Yuan, Method for manufacturing a thermal interface material.
  81. Huang, Hua; Wu, Yang; Liu, Chang-Hong; Fan, Shou-Shan, Method for manufacturing a thermal interface material.
  82. Huang, Hua; Liu, Chang Hong; Fan, Shou Shan, Method for manufacturing thermal interface material with carbon nanotubes.
  83. Colgan, Evan G.; Pan, Yi; Toy, Hilton T.; Zitz, Jeffrey A., Method of fabricating a chip module with stiffening frame and directional heat spreader.
  84. Zhang,Yuegang; Dubin,Valery M.; Garner,C. Michael, Method of fabricating a composite carbon nanotube thermal interface device.
  85. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Simons,Robert E., Method of fabrication for a thermal spreader using thermal conduits.
  86. Yoshimura,Hideaki, Method of making a semiconductor device with improved heat dissipation.
  87. Cola, Baratunde A.; Fisher, Timothy S., Methods for attaching carbon nanotubes to a carbon substrate.
  88. Gu,Gang; Pan,Lawrence; Zhang,Lian, Methods for producing and using catalytic substrates for carbon nanotube growth.
  89. Dubin,Valery M., Methods of fabricating a composite carbon nanotube thermal interface device.
  90. Salessi, Nader, Modular LED lamp.
  91. Salessi, Nader, Modular LED lamp.
  92. Li, Jun; Meyyappan, Meyya; Dangelo, Carlos, Nanoengineered thermal materials based on carbon nanotube array composites.
  93. Li,Jun; Meyyappan,Meyya, Nanoengineered thermal materials based on carbon nanotube array composites.
  94. Koning, Paul A.; White, Bryan M., Nanotube modified solder thermal intermediate structure, systems, and methods.
  95. Koning,Paul A.; White,Bryan M., Nanotube modified solder thermal intermediate structure, systems, and methods.
  96. Stickler, Heather Lea; Babb, Samuel Martin; Mazurkiewicz, Paul Howard, Nanotube socket system and method.
  97. Wyland, Chris; Thoonen, Hendrikus Johannes Jacobus, Nanotube-based fluid interface material and approach.
  98. Shives, Gary D.; Hoffert, Gerald; Varela, William, Optimized frame system for a display device.
  99. Shives, Gary D.; Hoffert, Gerald; Varela, William, Optimized frame system for a display device.
  100. Shives, Gary D.; Varela, William, Optimized frame system for a liquid crystal display device.
  101. Shives, Gary D.; Varela, William, Optimized frame system for a liquid crystal display device.
  102. Dubin, Valery M.; Dory, Thomas S., Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface.
  103. Dubin,Valery M.; Dory,Thomas S., Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface.
  104. Dubin, Valery M; Dory, Thomas S., Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface.
  105. Fisher, Timothy S.; Hodson, Stephen L.; Cola, Baratunde A.; Bhuvana, Thiruvelu; Kulkarni, Giridhar, Palladium thiolate bonding of carbon nanotubes.
  106. Qiu, Huihe; Sun, Zhen; Chen, Xiaodan; Wang, Bin, Phase-change chamber with patterned regions of high and low affinity to a phase-change medium for electronic device cooling.
  107. Brewer, Peter D., Polymer-infused carbon nanotube array and method.
  108. Schulz, Martin, Power semiconductor module assembly with heat dissipating element.
  109. Gamboa, Paul; Kopera, John J C, Power supply with bidirectional DC-DC converter.
  110. Interrante, Marcus E.; Pan, Yi; Toy, Hilton T.; Zitz, Jeffrey A., Reducing directional stress in an orthotropic encapsulation member of an electronic package.
  111. Anderson, Nicole; Zhu, Bizhong, Reinforced silicone resin film and method of preparing same.
  112. Bailey, Debbie; Katsoulis, Dimitris Elias; Suto, Michitaka; Zhu, Bizhong, Reinforced silicone resin film and method of preparing same.
  113. Bailey, Debbie; Katsoulis, Dimitris Elias; Suto, Michitaka; Zhu, Bizhong, Reinforced silicone resin film and method of preparing same.
  114. Zhu, Bizhong, Reinforced silicone resin films.
  115. Zhu, Bizhong, Reinforced silicone resin films.
  116. Cherian, Gabe, SPRDR—heat spreader—tailorable, flexible, passive.
  117. Lim, Fong; Lee, See Yau; Heng, Yang Hong, Semiconductor chip assembly.
  118. Iijima, Makoto; Ueno, Seiji; Igawa, Osamu, Semiconductor device.
  119. Yoshimura,Hideaki, Semiconductor device with improved heat dissipation, and a method of making semiconductor device.
  120. Sugita, Masato; Kawase, Masayasu, Semiconductor memory device.
  121. Brunnbauer, Markus; Fink, Markus; Jetten, Hans-Gerd, Semiconductor module having a semiconductor chip stack and method.
  122. Brunnbauer, Markus; Fink, Markus; Jetten, Hans-Gerd, Semiconductor module having a semiconductor chip stack and method.
  123. Iwai, Taisuke; Kondo, Daiyu; Yamaguchi, Yoshitaka; Soga, Ikuo; Hirose, Shinichi, Sheet structure and method of manufacturing the same.
  124. Dispenza, Jace; Ferris, William, Shock-resistant camera mounting device and methods of forming the same.
  125. Fisher, Mark David; Zhu, Bizhong, Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition.
  126. Liu, Peng; Chen, Pi-Jin; Liu, Liang; Jiang, Kai-Li; Fan, Shou-Shan, Solar collector and solar heating system using same.
  127. Chang, Chih-Wei; Majumdar, Arunava; Zettl, Alexander K., Solid state thermal rectifier.
  128. Sung, Chien-Min; Kan, Ming Chi; Hu, Shao Chung, Stress regulated semiconductor devices and associated methods.
  129. Sung, Chien-Min; Kan, Ming-Chi; Hu, Shao Chung, Stress regulated semiconductor devices and associated methods.
  130. Grip, Robert E.; Rawdon, Blaine K.; Jalewalia, Gurpreet S., Structurally isolated thermal interface.
  131. Dispenza, Jace; Ferris, William, Suspension housing for camera mount.
  132. Chopra,Nasreen G., System and method for developing production nano-material.
  133. Kuczynski, Joseph; Sinha, Arvind K.; Splittstoesser, Kevin A.; Tofil, Timothy J., System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks.
  134. Dangelo, Carlos, System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler.
  135. Dangelo,Carlos; Meyyappan,Meyya; Li,Jun, System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler.
  136. Hartmann, Mark; Roda, Greg, Systems structures and materials for electronic device cooling.
  137. Hartmann, Mark; Roda, Greg, Systems, structures and materials for electronic device cooling.
  138. Misra, Sanjay, Thermal diffusion apparatus.
  139. Hannah, Eric C.; Kling, Ralph M., Thermal interface.
  140. Zhang,Yuegang; Garner,C. Michael; Berlin,Andrew A.; Rao,Valluri; White,Bryan M.; Koning,Paul A., Thermal interface apparatus, systems, and methods.
  141. Chen, Ga-Lane; Leu, Charles, Thermal interface material.
  142. Fan, Shoushan; Liu, Pao Lo; Huang, Hua; Li, YoungDe, Thermal interface material and method for making same.
  143. Huang,Hua; Liu,Chang Hong; Fan,Shou Shan, Thermal interface material and method for making the same.
  144. Huang,Hua; Liu,Chang Hong; Fan,Shou Shan, Thermal interface material and method for manufacturing same.
  145. Huang,Hua; Wu,Yang; Liu,Chang Hong; Fan,Shou Shan, Thermal interface material and method for manufacturing same.
  146. Leu,Charles; Yu,Tai Cherng; Chen,Ga Lane, Thermal interface material and method for manufacturing same.
  147. Wu, Yang; Huang, Hua; Liu, Chang-Hong; Fan, Shou-Shan, Thermal interface material and method for manufacturing same.
  148. Huang,Hua; Liu,Chang Hong; Fan,Shou Shan, Thermal interface material with carbon nanotubes.
  149. Hua, Fay; Maveety, James G., Thermal interface material with carbon nanotubes and particles.
  150. Leu,Charles; Yu,Tai Cheng; Chen,Ga Lane, Thermal interface with silver-filled carbon nanotubes.
  151. White, Bryan M.; Koning, Paul A.; Zhang, Yuegang; Garner, C. M., Thermal intermediate apparatus, systems, and methods.
  152. White,Bryan M.; Koning,Paul A.; Zhang,Yuegang; Garner,C. Michael, Thermal intermediate apparatus, systems, and methods.
  153. Zhang, Jian; Tonapi, Sandeep Shrikant; Mills, Ryan Christopher; Gowda, Arun Virupaksha, Thermal management system and associated method.
  154. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Thermal spreader using thermal conduits.
  155. Zhang,Jian; Tonapi,Sandeep Shrikant; Mills,Ryan Christopher; Gowda,Arun Virupaksha, Thermal transport structure and associated method.
  156. Jewram, Radesh; Misra, Sanjay, Thermally and electrically conductive interconnect structures.
  157. Santana, Jr.,Miguel; Bruce,Michael; Chu,Thomas; Goruganthu,Rama R.; Powell,Robert, Thermally conductive integrated circuit mounting structures.
  158. Santana, Jr.,Miguel; Bruce,Michael; Chu,Thomas; Goruganthu,Rama R.; Powell,Robert, Thermally conductive integrated circuit mounting structures.
  159. Takayama, Yoshinari; Hida, Takafumi; Kitagawa, Daisuke; Tagawa, Kenichi; Nagasaki, Kunio; Matsushima, Ryoichi; Kiyohara, Susumu; Uota, Toshio, Thermally-conductive sheet, LED mounting substrate, and LED module.
  160. Dangelo, Carlos; Spitzer, Jason, Vapor chamber heat sink having a carbon nanotube fluid interface.
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