초록 ▼

Chemical microreactors for chemical systhesis and their methods of manufacture are known, but have disadvantages such as extremely high manufacturing costs or poor flexibility for adaptation to various cases of application. These disadvantages are avoided by means of the microreactors and manufactur

Chemical microreactors for chemical systhesis and their methods of manufacture are known, but have disadvantages such as extremely high manufacturing costs or poor flexibility for adaptation to various cases of application. These disadvantages are avoided by means of the microreactors and manufacturing methods according to the invention. The microreactors are characterized in that the reactors contain fluid ducts in at least one plane as well as feed and return lines for fluids, wherein the fluid ducts are defined by side walls of metal opposing each other and further side walls of metal or plastic extending between said side walls, and in which the planes are connected together and/or with a closure segment closing open fluid ducts by means of appropriate solder or adhesive layers. The manufacturing method is characterized by process sequences in which the individual reactor planes produced by means of electrolytic methods, are connected together by soldering or gluing.

대표청구항 ▼

1. Manufacturing process for chemical microreactors including at least one substrate with a metal coating on at least one side thereof, the process forming fluid ducts as well as feeding and drain ducts for fluids, without using plastic molding techniques comprising the following steps of:a.) coatin

1. Manufacturing process for chemical microreactors including at least one substrate with a metal coating on at least one side thereof, the process forming fluid ducts as well as feeding and drain ducts for fluids, without using plastic molding techniques comprising the following steps of:a.) coating with a resist layer in a pattern forming fluid duct structures for forming fluid ducts on a metal surface located on each substrate by layering means selected from a group consisting of photoresist layering and screen-printed varnish layering, so that the metal surfaces are partly covered by the resist coating layer; b.) removing metal from each uncoated metal surface of each substrate by a process selected from the group consisting of electroless and electrochemical etching; c.) totally removing the resist coating layer; d.) forming solder layers by depositing metals that can form eutectics; e.) superimposing each substrate and a closure segment closing the fluid ducts, and interconnecting each substrate and the closure segment by soldering.