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A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features ar

A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a good electrical properties, including precise impedance control and low cross talk.

대표청구항 ▼

1. A method of manufacturing an electrical connector assembled from wafers, including a process of manufacturing the wafers comprising:a) providing a shield plate having an upper surface and a lower surface, the shield plate having a plurality of contact tails extending therefrom, the contact tails

1. A method of manufacturing an electrical connector assembled from wafers, including a process of manufacturing the wafers comprising:a) providing a shield plate having an upper surface and a lower surface, the shield plate having a plurality of contact tails extending therefrom, the contact tails connected to the shield plate through a portion bent to raise the contact tail above the plane of the shield plate; b) providing a first dielectric housing on the shield plate, the first dielectric housing having a cavity and a plurality of openings extending from the cavity and the first dielectric housing also encapsulating the bent portions attaching the contact tails to the shield plate; c) providing a plurality of signal contacts, each of the signal contacts having a contact tail, a contact region and an intermediate portion joining the contact tail and the contact region; d) inserting the plurality of signal contacts into the first dielectric housing with the intermediate portions in the cavity, the contact regions in one of the plurality of openings and the contact tails extending from the first dielectric housing; and e) providing a second dielectric housing substantially over the cavity, thereby securing the shield, the first dielectric housing and the signal contacts together as a wafer, whereby the contact tails of the shield plate and the signal contacts are secured.