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Method and apparatus for depositing and controlling the texture of a thin film 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C25D-005/52
  • C25D-005/50
  • C25D-005/00
출원번호 US-0373681 (1999-08-13)
발명자 / 주소
  • Cyprian Emeka Uzoh
  • Homayoun Talieh
출원인 / 주소
  • Nutool, Inc.
대리인 / 주소
    Pillsbury Winthrop LLP
인용정보 피인용 횟수 : 71  인용 특허 : 17

초록 ▼

The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film while the substrate is being plated. The present invention further provides a method and apparatus that plates a conductive material

대표청구항 ▼

1. A method for altering the texture of a top portion of a conductive layer formed on a substrate, the method comprising the steps of:(1) plating the conductive layer on the substrate by applying a plating solution thereto using an anode and a pad disposed in proximity to the substrate, when the ano

이 특허에 인용된 특허 (17)

  1. Talieh Homayoun (San Jose CA), Chemical mechanical polishing apparatus with improved slurry distribution.
    상세보기
  2. Brusic Vlasta A. ; Marino Jeffrey Robert ; O'Sullivan Eugene John ; Sambucetti Carlos Juan ; Schrott Alejandro Gabriel ; Uzoh Cyprian Emeka, Cobalt-tin alloys and their applications for devices, chip interconnections and packaging.
    상세보기
  3. Uzoh Cyprian E., Continuous highly conductive metal wiring structures and method for fabricating the same.
    상세보기
  4. Palnik Karl (Huntingdon Valley PA), Electrolytic plating apparatus.
    상세보기
  5. Dubin Valery, Electroplating apparatus.
    상세보기
  6. Ichinose Hirofumi,JPX ; Sawayama Ippei,JPX ; Hasebe Akio,JPX ; Murakami Tsutomu,JPX ; Hisamatsu Masaya,JPX ; Shinkura Satoshi,JPX ; Ueno Yukie,JPX, Etching method and process for producing a semiconductor element using said etching method.
    상세보기
  7. Talieh Homayoun (Santa Clara County CA) Weldon David Edwin (Santa Cruz County CA), Linear polisher and method for semiconductor wafer planarization.
    상세보기
  8. Talieh Homoyoun (Sunnyvale CA) Tepman Avi (Cupertino CA) Kieu Hoa Thi (Sunnyvale CA) Wang Chien-Rhone (Milpitas CA), Material deposition method for integrated circuit manufacturing.
    상세보기
  9. Talieh Homayoun, Method and apparatus for electro-chemical mechanical deposition.
    상세보기
  10. Kadija Igor V. (118 Sherwood Rd. Ridgewood NJ 07450), Method and apparatus for manufacturing interconnects with fine lines and spacing.
    상세보기
  11. Kosaki Katsuya (Itami JPX), Method for manufacturing semiconductor device contact.
    상세보기
  12. Uzoh Cyprian Emeka ; Harper James McKell Edwin, Method of electrochemical mechanical planarization.
    상세보기
  13. Liu Yauh-Ching ; Perng Dung-Ching, Method of single step damascene process for deposition and global planarization.
    상세보기
  14. Simon Andrew H. ; Uzoh Cyprian E., Open-bottomed via liner structure and method for fabricating same.
    상세보기
  15. Ishida Hirofumi (Kanagawa JPX), Plating device for wafer.
    상세보기
  16. Watts John D. (2 Mohawk Drive Clinton CT 06413), Surface finishing and plating method.
    상세보기
  17. Talieh Homayoun (San Jose CA) Weldon David E. (Los Gatos CA) Nagorski Boguslaw A. (San Jose CA), Wafer polishing machine with fluid bearings.
    상세보기

이 특허를 인용한 특허 (71)

  1. Sun,Lizhong; Tsai,Stan; Redeker,Fritz, Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus.
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  2. Manens, Antoine P.; Duboust, Alain; Neo, Siew S.; Chen, Liang Yuh, Algorithm for real-time process control of electro-polishing.
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  3. Manens,Antoine P.; Duboust,Alain; Neo,Siew S.; Chen,Liang Yuh, Algorithm for real-time process control of electro-polishing.
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  4. Tietz,James V.; Li,Shijian; Birang,Manoocher; White,John M.; Rosenberg, legal representative,Sandra L.; Scales,Marty; Emami,Ramin; Rosenberg, deceased,Lawrence M., Article for polishing semiconductor substrates.
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  5. Li,Shijian; Chen,Llang Yuh; Duboust,Alain, Articles for polishing semiconductor substrates.
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  6. Mavliev,Rashid A.; Wadensweiler,Ralph M., Conductive pad.
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  7. Mavliev, Rashid A.; Karuppiah, Lakshmanan, Conductive pad design modification for better wafer-pad contact.
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  11. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain, Conductive polishing article for electrochemical mechanical polishing.
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  12. Butterfield,Paul D.; Chen,Liang Yuh; Hu,Yonqi; Manens,Antoine P.; Mavliev,Rashid; Tsai,Stan D.; Liu,Feng Q.; Wadensweiler,Ralph; Sun,Lizhong; Neo,Siew S.; Duboust,Alain, Conductive polishing article for electrochemical mechanical polishing.
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  13. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
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  14. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
    상세보기
  15. Chen,Liang Yuh; Wang,Yuchun; Wang,Yan; Duboust,Alain; Carl,Daniel A.; Wadensweiler,Ralph; Birang,Manoocher; Butterfield,Paul D.; Mavliev,Rashid; Tsai,Stan D., Conductive polishing article for electrochemical mechanical polishing.
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  16. Hu, Yongqi; Wang, Yan; Duboust, Alain; Liu, Feng Q.; Mavliev, Rashid; Chen, Liang-Yuh; Morad, Ratson; Somekh, Sasson, Conductive polishing article for electrochemical mechanical polishing.
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  17. Hu,Yongqi; Wang,Yan; Duboust,Alain; Liu,Feng Q.; Manens,Antoine P.; Neo,Siew S.; Tsai,Stan D.; Chen,Liang Yuh; Butterfield,Paul D.; Tian,Yuan A.; Ko,Sen Hou, Conductive polishing article for electrochemical mechanical polishing.
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