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Thermoelectric module with thin film substrates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-031/058
  • H01L-023/38
  • H01L-027/16
  • H01L-035/00
  • H01L-025/28
출원번호 US-0998090 (2001-11-29)
발명자 / 주소
  • Robert W. Otey
출원인 / 주소
  • Ferrotec (USA) Corporation
대리인 / 주소
    Robert R. Deleault, Esq.
인용정보 피인용 횟수 : 73  인용 특허 : 20

초록 ▼

A flexible thermoelectric module having a pair of flexible substrates, a plurality of electrically conductive contacts on one side of each of the flexible substrates, and a plurality of P-type and N-type thermoelectric elements electrically connected between opposing sides of the pair of flexible su

대표청구항 ▼

1. A thermoelectric module comprising:a pair of substrates, wherein at least one of the substrates is a flexible substrate; a plurality of electrically conductive contacts disposed on opposing faces of said pair of substrates; and a plurality of P-type and N-type thermoelectric elements interposed b

이 특허에 인용된 특허 (20)

  1. Lewis David A. (Carmel NY) Narayan Chandrasekhar (Hopewell Junction NY), Device to monitor and control the temperature of electronic chips to enhance reliability.
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  2. Shakouri Ali ; Bowers John E., Heterostructure thermionic coolers.
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  3. Meissner Edward G., Integrated circuit package having a thermoelectric cooling element therein.
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  4. Miller Joel (14340 Trinidad Rd. San Leandro CA 94577), Laminated thermo element.
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  5. Schmidt William L. (Acton MA) Olson Richard E. (Rindge NH) Solley Dennis J. (Windham NH), Localized cooling apparatus for cooling integrated circuit devices.
    상세보기
  6. Paige David F., Microfabricated silicon thermopile sensor.
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  7. Chi Cheng-Chung John,TWX ; Huebener Rudolf Peter,DEX ; Tsuei Chang Chyi, On-chip Peltier cooling devices on a micromachined membrane structure.
    상세보기
  8. Ghoshal Uttam Shyamalindu, Solid state thermal switch.
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  9. Imanishi Yuichiro,JPX ; Miyoshi Makoto,JPX ; Watanabe Tetsuo,JPX ; Kushibiki Keiko,JPX ; Shinohara Kazuhiko,JPX ; Kobayashi Masakazu,JPX ; Furuya Kenji,JPX, Thermoelectric conversion module having channels filled with semiconducting material and insulating fillers.
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  10. Yamamura Akira (c/o Nippon Ferrofluidics Corporation ; 17-22 ; Akasaka 2-chome Minato-ku ; Tokyo ; 107 MA JPX) Baldwin John (c/o International Thermoelectric Incorporated ; 131 Stedman St. Chelmsford, Thermoelectric conversion module with series connection.
    상세보기
  11. Kishi Matsuo,JPX ; Nemoto Hirohiko,JPX ; Okano Hiroshi,JPX, Thermoelectric device.
    상세보기
  12. Kishi Matsuo,JPX ; Nemoto Hirohiko,JPX ; Okano Hiroshi,JPX, Thermoelectric device.
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  13. Macris Chris, Thermoelectric device and method of manufacture.
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  14. Sakuragi Shiro,JPX, Thermoelectric element and cooling or heating device provided with the same.
    상세보기
  15. Koyanagi Tadamasa (Yasatomachi JPX) Oohira Tsunehiro (Tsukuba JPX), Thermoelectric element sheet in which thermoelectric semiconductors are mounted between films.
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  16. Fritz Robert E. (2041 Vista Del Mar San Mateo CA 94404) Monkowski Joseph R. (1850 Lawrence Rd. Danville CA 94506), Thermoelectric module having reduced spacing between semiconductor elements.
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  17. Yokotani Youichirou (Osaka JPX) Kugimiya Kouichi (Osaka JPX) Ando Hamae (Osaka JPX), Thermoelectric semiconductor having a porous structure deaerated in a vacuum and thermoelectric panel using p-type and n.
    상세보기
  18. Yokotani Youichirou (Suita JPX) Kugimiya Kouichi (Toyonaka JPX) Ando Hamae (Neyagawa JPX), Thermoelectric semiconductor having a porous structure deaerated in a vacuum and thermoelectric panel using p-type and n.
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  19. Tsuno Katsuhiro,JPX ; Tosho Tsuyoshi,JPX ; Watanabe Hideo,JPX, Thermoelectric semiconductor having a sintered semiconductor layer and fabrication process thereof.
    상세보기
  20. Hidaka Norio,JPX, Thermoelectric system using semiconductor.
    상세보기

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  10. Prasher, Ravi, Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel.
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