초록 ▼

Embodiments of the present invention can dissipate heat and include a top wall including a plurality of hollow fins, a bottom wall, and a plurality of side walls that define an inner cavity. A plurality of condenser regions can be located within the inner cavity, and each one of the plurality of con

Embodiments of the present invention can dissipate heat and include a top wall including a plurality of hollow fins, a bottom wall, and a plurality of side walls that define an inner cavity. A plurality of condenser regions can be located within the inner cavity, and each one of the plurality of condenser regions can be located within one of the plurality of hollow fins. The inner cavity also can include an evaporator region adjacent said bottom wall.

대표청구항 ▼

1. A circuit board assembly, comprising:a circuit board; and a semiconductor package coupled to said circuit board, said semiconductor package including an integrated circuit device, a substrate, and a package cover, said package cover including a top wall including a plurality of hollow fins, a bot

1. A circuit board assembly, comprising:a circuit board; and a semiconductor package coupled to said circuit board, said semiconductor package including an integrated circuit device, a substrate, and a package cover, said package cover including a top wall including a plurality of hollow fins, a bottom wall, said integrated circuit device thermally coupled to said bottom wall, a plurality of side walls, and a plurality of channels, said top wall, including said plurality of hollow fins, and said bottom wall being attached to said plurality of side walls to define an inner cavity, said inner cavity including a plurality of condenser regions, each one of said plurality of condenser regions located within one of said plurality of hollow fins, and an evaporator region adjacent said bottom wall, said plurality of channels attached to and extending from the interior surface of said inner cavity within said condenser and evaporator regions, wherein said bottom wall and said substrate are attached to said plurality of side walls to enclose said integrated circuit device.