초록 ▼

Embodiments of integrated circuit packages for housing a plurality of integrated circuits are disclosed, along with methods of making the packages. One integrated circuit package comprises a substrate having a first surface having first metallizations thereon, an opposite second surface, and a plura

Embodiments of integrated circuit packages for housing a plurality of integrated circuits are disclosed, along with methods of making the packages. One integrated circuit package comprises a substrate having a first surface having first metallizations thereon, an opposite second surface, and a plurality of apertures between the first and second surfaces. A first integrated circuit having a first surface with first bond pads thereon and an opposite second surface is mounted on the second surface of the substrate so that the first bond pads are superimposed with an aperture. Each first bond pad is electrically connected by a first bond wire extending through the superimposing aperture to a first metallization. A second integrated circuit having a first surface with conductive second bond pads thereon is mounted on the second surface of the first integrated circuit. In particular, the first surface of the second integrated circuit is placed on the second surface of the first integrated circuit so that the second bond pads are superimposed with one or more of the apertures through the substrate. Each second bond pad is electrically connected by a second bond wire extending through the superimposing aperture to a first metallization.

대표청구항 ▼

1. An integrated circuit package comprising:a substrate having a first surface with first metallizations thereon, an opposite second surface, and a plurality of apertures between the first and second surfaces; a first integrated circuit having a first surface with first bond pads thereon and an oppo

1. An integrated circuit package comprising:a substrate having a first surface with first metallizations thereon, an opposite second surface, and a plurality of apertures between the first and second surfaces; a first integrated circuit having a first surface with first bond pads thereon and an opposite second surface, wherein the first surface of the first integrated circuit is on the second surface of the substrate, the first bond pads are superimposed with at least one of the apertures, and each first bond pad is electrically connected by a first bond wire extending through the superimposing aperture to a first metallization; and a second integrated circuit having a first surface with conductive second bond pads thereon, wherein the first surface of the second integrated circuit is on the second surface of the first integrated circuit, the second bond pads are superimposed with at least one of the apertures, and each second bond pad is electrically connected by a second bond wire extending through the superimposing aperture to a first metallization.