초록 ▼

The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplyi

The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. Preferably, the anode comprises a consumable metal source disposed in a liquid permeable structure, and the anode and a cavity ring define a cavity for holding and distributing the electroplating solution to the substrate plating surface. Preferably, the substrate support member comprises a vacuum chuck having vacuum ports disposed on the substrate supporting surface that serves to provide suction during processing and to provide a blow-off gas flow to prevent backside contamination during substrate transfers. The substrate support member also rotates and vibrates during processing to enhance the electro-deposition onto the substrate plating surface.

대표청구항 ▼

1. An apparatus for electroplating a met al onto a substrate having a substrate plating surface, comprising:a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process; a cathode clamp ring

1. An apparatus for electroplating a met al onto a substrate having a substrate plating surface, comprising:a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process; a cathode clamp ring disposed in electrical contact with the substrate plating surface; an anode disposed above the substrate support member, an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface; a power source connected to the anode and the cathode clamp ring, wherein an electrical contact to the cathode clamp ring is isolated from a region between the substrate support member and the anode, a cavity ring disposed below the electroplating solution inlet, the cavity ring and the anode defining a cavity for holding the electroplating solution; and an actuator connected to the cavity ring to move the cavity ring about a substantially horizontal plane.