초록 ▼

The invention relates to a solid-state imaging device (1) which is encapsulated in a ceramic package covered by a transparent window (6) comprising a phosphorus-containing glass. The window is provided with a coating (8), for example of chromium, at the circumference of the window to counteract degr

The invention relates to a solid-state imaging device (1) which is encapsulated in a ceramic package covered by a transparent window (6) comprising a phosphorus-containing glass. The window is provided with a coating (8), for example of chromium, at the circumference of the window to counteract degradation of the joint between the window and the ceramic package, which degradation results from the sensitivity of phosphorus glass to moisture. The use of phosphorus glass has the advantage that it is opaque to infrared radiation, so that the application of a separate coating serving as an IR filter is avoided and hence the dependence of the sensitivity of the imaging device on the angle of incidence of the radiation to be detected.

대표청구항 ▼

1. A solid-state imaging device comprising a semiconducting imaging element with a radiation-sensitive surface, which imaging element is provided in a housing which is covered, at the side facing the radiation-sensitive surface, with a window of a transparent material which is attached to the envelo

1. A solid-state imaging device comprising a semiconducting imaging element with a radiation-sensitive surface, which imaging element is provided in a housing which is covered, at the side facing the radiation-sensitive surface, with a window of a transparent material which is attached to the envelope by means of an adhesive, characterized in that the transparent material includes a layer of phosphorus glass, and in that at least the side of the window facing the radiation-sensitive surface is provided with a coating consisting of a layer of chromium which improves the bond between the window and the ceramic housing and which leaves the part of the window via which an image is projected on the imaging element exposed.