초록 ▼

A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter boards have electronic memory ICs mounted on the respective surfaces. The primary board and each of the d

A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter boards have electronic memory ICs mounted on the respective surfaces. The primary board and each of the daughter boards have mounted connectors so that the boards can be electronically and mechanically interconnected with another board.

대표청구항 ▼

1. Method of augmenting memory in a stacked memory module, the method comprising:providing a primary circuit board having a first and second surface adapted for mounting electronic components, wherein at least the first surface of the primary board has at least one primary connector and at least one

1. Method of augmenting memory in a stacked memory module, the method comprising:providing a primary circuit board having a first and second surface adapted for mounting electronic components, wherein at least the first surface of the primary board has at least one primary connector and at least one electronic component; providing a daughter circuit board having a first and second surface adapted for mounting electronic components, wherein at least the first surface of the daughter board has at least one electronic component and at least one daughter connector; removeably coupling at least one primary connector to at least one daughter connector so as to define an electrical connection and to form a configuration such that the first surface of the primary board and the first surface of the daughter board face each other and such that the primary and daughter connectors and the electronic components on said first side of the primary and daughter boards define at least one channel that is free of said connector and components and which extends between two edges of said primary and daughter boards so as to conduct heat from said electronic components away from said primary and daughter boards via said at least one channel; connecting a control connector to a port on a supporting structure; and connecting the control connector to an end of the primary board.