초록 ▼

A method of making a package for an integrated circuit device having an optical cell is disclosed. The package includes a base of molded encapsulant material. A metal leadframe is embedded in the plastic base at the upper surface of the base. Encapsulant material covers the lower and side surfaces o

A method of making a package for an integrated circuit device having an optical cell is disclosed. The package includes a base of molded encapsulant material. A metal leadframe is embedded in the plastic base at the upper surface of the base. Encapsulant material covers the lower and side surfaces of the die pad and the leads of the leadframe, but does not cover the upper surfaces of the die pad and leads. An optical integrated circuit device is attached to the exposed surface of the die pad. An adhesive bead is applied around the optical device on the exposed upper surface of the leads. An optically clear cover is placed on the adhesive bead. When hardened, the bead supports the cover above the optical device.

대표청구항 ▼

1. A method of making a package for an integrated circuit device comprising:providing a metal leadframe, said leadframe including a die pad and a plurality of leads, wherein said die pad and said leads include a first surface, an opposite second surface, and a side surface between the first surface

1. A method of making a package for an integrated circuit device comprising:providing a metal leadframe, said leadframe including a die pad and a plurality of leads, wherein said die pad and said leads include a first surface, an opposite second surface, and a side surface between the first surface and the second surface; molding a base of an adhesive insulative material to the leadframe, so that the second surface and side surface of the die pad and the second surface and side surface of a first portion of the leads are covered with the insulative material of the base, and the first surfaces of the die pad and of the first portion of the leads are exposed at a first surface of the base; providing an integrated circuit device having a first surface that includes a light sensitive portion, and an opposite second surface; placing the second surface of the integrated circuit device on the first surface of the die pad; electrically connecting the integrated circuit device and the first portion of each of said leads; applying a viscous adhesive bead on the first surface of the base around said integrated circuit device, said bead extending to a height above the first surface of the integrated circuit device; providing an optically clear planar cover having a first surface; placing said first surface of the cover on said adhesive bead around said integrated circuit device, so that said cover transmits light to said light sensitive portion and said integrated circuit device is enclosed in a cavity formed by the first surface of said base, said adhesive bead, and said first surface of said cover; and hardening said adhesive bead, so that said adhesive bead supports said optically clear cover above said integrated circuit device.