Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C08L-009/00
출원번호
US-0292842
(1999-04-16)
우선권정보
JP-0122978 (1998-04-16)
발명자
/ 주소
Toshiaki Yamada JP
Hiroaki Hasegawa JP
Yoshiyuki Yasukawa JP
Kenji Endou JP
Michihisa Yamada JP
Yasuo Moriya JP
Tomiho Yamada JP
Tetsuya Itoh JP
출원인 / 주소
TDK Corporation JP
NOF Corporation JP
대리인 / 주소
Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보
피인용 횟수 :
17인용 특허 :
4
초록▼
The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using th
The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.
대표청구항▼
1. A composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material (I) that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms i
1. A composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material (I) that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in all of said resins in said dielectric material composition is at least 99% of the total number of atoms in all of said resins, and a filler (II), wherein said heat-resistant, low-dielectric polymeric material is a copolymer in which a non-polar .alpha.-olefin base (co)polymer segment and/or a non-polar conjugated diene base (co)polymer segment are chemically combined with a vinyl aromatic (co)polymer segment containing a monomer of divinylbenzene, and is a thermoplastic resin which shows a multi-phase structure wherein a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment,and wherein said heat-resistant, low-dielectric polymeric material in pulverized form is insoluble in xylene of 120.degree. C.
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