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A cooling arrangement facilitates the cooler and quieter operation of an electronic system located within an enclosure, wherein the electronic system includes a plurality of circuit boards having a plurality of integrated circuit elements disposed within a lower portion of the enclosure. In one embo

A cooling arrangement facilitates the cooler and quieter operation of an electronic system located within an enclosure, wherein the electronic system includes a plurality of circuit boards having a plurality of integrated circuit elements disposed within a lower portion of the enclosure. In one embodiment, the cooling arrangement includes a pump located within the enclosure that has a first and second coolant ports and a heat exchanger that is disposed within a top portion of the enclosure and is coupled to the first coolant port. The cooling arrangement also includes a thermally conductive member having a first surface and a second surface, the first surface being in thermal contact with at least one of the integrated circuit elements. A first cooling plate arrangement having a coolant channel with a first end coupled to the second coolant port and a second end coupled to the heat exchanger. A cold plate is included in the cooling arrangement that is in thermal contact with the second surface of the thermally conductive member.

대표청구항 ▼

1. A cooling arrangement for an electronic system located within an enclosure, the electronic system including a plurality of circuit boards disposed within a lower portion of the enclosure and having a plurality of integrated circuit elements disposed thereon, the cooling arrangement comprising:a p

1. A cooling arrangement for an electronic system located within an enclosure, the electronic system including a plurality of circuit boards disposed within a lower portion of the enclosure and having a plurality of integrated circuit elements disposed thereon, the cooling arrangement comprising:a pump located within the enclosure and having a first and second coolant ports; a heat exchanger disposed within a top portion of the enclosure and coupled to the first coolant port; a thermally conductive member having a first surface and a second surface, the first surface being in thermal contact with at least one of the integrated circuit elements, wherein the thermally conductive member includes a U-shaped member having a set of leg portions connected with a top portion and an open end disposed over a respective one of the circuit boards, a first surface of at least one of the leg portions being in contact with the circuit element; and a first cooling plate arrangement having a coolant channel with a first end coupled to the second coolant port and a second end coupled to the heat exchanger and in thermal contact with the second surface of the thermally conductive member.