초록 ▼

A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the flui

A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

대표청구항 ▼

1. A method for processing a workpiece, comprising the steps of:spinning the workpiece; applying a processing fluid to a first side of the workpiece; allowing the processing fluid to flow outwardly over the first side of the workpiece, via centrifugal force generated by the spinning; collecting the

1. A method for processing a workpiece, comprising the steps of:spinning the workpiece; applying a processing fluid to a first side of the workpiece; allowing the processing fluid to flow outwardly over the first side of the workpiece, via centrifugal force generated by the spinning; collecting the processing fluid at the perimeter of the workpiece, so that the processing fluid flows onto an outer annular area of a second side of the workpiece.