초록 ▼

A compact, volatile organic compound removal system is presented. The system has a metal condensation plate and a cooling source in intimate thermal contact with the metal condensation plate. The metal condensation plate has a channel formed in the plate, an inlet in the condensation plate for intro

A compact, volatile organic compound removal system is presented. The system has a metal condensation plate and a cooling source in intimate thermal contact with the metal condensation plate. The metal condensation plate has a channel formed in the plate, an inlet in the condensation plate for introducing a gas carrying volatile organic compound vapors into the channel, a high surface area metallic structure, such as foamed metal or metallic fins, in intimate contact with the walls of the channel, an outlet in the condensation plate for removing the gas from the channel and a drain in the condensation plate for removing volatile organic compound condensates from the channel. The cooling source cools the channel walls and the high surface area metallic structure so that the volatile organic compound vapors condense on the high surface area metallic structure to be removed from the gas.

대표청구항 ▼

1. A compact, volatile organic compound removal system, comprisinga metal condensation plate having a first metal plate and a second metal plate defining a channel therebetween; an inlet in said condensation plate for introducing a gas carrying volatile organic compound vapors into said channel; a h

1. A compact, volatile organic compound removal system, comprisinga metal condensation plate having a first metal plate and a second metal plate defining a channel therebetween; an inlet in said condensation plate for introducing a gas carrying volatile organic compound vapors into said channel; a high surface area metallic structure in said channel in intimate contact with said first and second metal plates; an outlet in said condensation plate for removing said gas from said channel; a drain in said condensation plate for removing volatile organic compound condensates from said channel; and a cooling source in intimate thermal contact with said metal condensation plate for cooling at least one of said first and second metal plates and said high surface area metallic structure so that said volatile organic compound vapors condense on said high surface area metallic structure to be removed from said gas.