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특허 상세정보

Method for attenuating thermal sensation when handling objects at non-body temperature

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B32B-015/00    B32B-018/00    B32B-025/00    B32B-031/00   
미국특허분류(USC) 428/332; 428/4111; 428/457; 99/385; 99/372; 181/131; 219/443; 361/705; 361/706; 381/067; 427/307
출원번호 US-0966168 (1997-11-07)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Daniel P. Morris
인용정보 피인용 횟수 : 6  인용 특허 : 15
초록

A method for fabricating an object to attenuate thermal sensation when handling the object at non-body temperature, and an object fabricated in accord with the method. There is first provided a substrate which has a first surface subject to handling. There is then formed upon the first surface of the substrate a coating. The coating has an optimal density, an optimal thermal conductivity and an optimal thickness such that when the substrate having the coating formed thereupon is equilibrated at a non-body temperature differing from a body temperature and...

대표
청구항

1. A method for fabricating an electronics product comprising:providing an electronics product selected from the group consisting of handheld computers and mobile computers, the electronics product having a surface subject to handling forming upon the surface subject to handling a coating formed from an inorganic material, where the inorganic material has a density of tom about 0.05 to about 1.2 grams per cubic centimeter, a thermal conductivity of from about 0.02 to about 0.15 watts per meter-degree kelvin and a thickness of form about 0.1 to about 3.0 ...

이 특허에 인용된 특허 (15)

  1. Kikuchi Hiroshi,JPX. Device for electrically connecting equipment and case accommodating the equipment. USP1998125848904.
  2. Ono Hideyo (Hyogo JPX) Yoshitake Kunitoshi (Hyogo JPX) Kakuta Nobuyuki (Hyogo JPX). Electronic device housing with temperature management functions. USP1991095045971.
  3. Jeffries John ; Wang Ray. Heat dissipator with multiple thermal cooling paths. USP1998115829515.
  4. Andersen Per Just (Santa Barbara CA) Hodson Simon K. (Santa Barbara CA). Highly insulative cementitious matrices and methods for their manufacture. USP1997065641584.
  5. Delmonico John A. (Arvada CO). Insulating paint for interior and exterior of buildings and method of making same. USP1986114623390.
  6. Yoneno Hiroshi (Osaka JA) Inami Akira (Hirakata JA). Insulation material. USP1976013933666.
  7. Childers Winthrop D. (San Diego CA) Schantz Chris (Redwood City CA) Hanson Eric (Burlingame CA). Plastic substrate for thermal ink jet printer. USP1990054926197.
  8. Pan Alfred I-Tsung (Sunnyvale CA) Hanson Eric G. (Burlingame CA) Schantz Christopher A. (Redwood City CA) Childers Winthrop D. (San Diego CA). Plastic substrate for thermal ink jet printer. USP1991045008689.
  9. Jones Allan S. ; White Alan W.. Polyesters for metal lamination. USP1998035725944.
  10. James Barry S. (Rugby GB2). Pre-etch treatment of a plastic substrate. USP1994055308387.
  11. McClean John W. (Roselands AUX). Sandwich toaster. USP1992085138938.
  12. Morshauser Fred S. (Pequannock Township ; Passaic County NJ) Roberts Luther L. (North Plainfield NJ). Surface treatment of rigid polyvinyl chloride. USP1979054154887.
  13. Dubois Jean-Marie (Pompey FRX) Cathonnet Philippe (Avignon FRX). Thermal barriers, material and process for their production. USP1995125472920.
  14. Varmazis Costas D. ; Kaleta Anthony. Two layer hermetic-like coating process for on-wafer encapsulation of GaAs MMIC's. USP1999065914508.
  15. Antoni ; Gerhard. Weatherproof and mechanically stable laminate for encasing thermal insulation. USP1978084105820.