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Telecommunications enclosure with individual, separated card holders 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0781178 (2001-02-12)
발명자 / 주소
  • Randall D. Hutchinson
  • Tomasz Taubert
출원인 / 주소
  • Special Product Company
대리인 / 주소
    Hovey Williams LLP
인용정보 피인용 횟수 : 21  인용 특허 : 29

초록

A telecommunications equipment enclosure (10) that more effectively dissipates heat from electronic cards without transferring the heat to adjacent cards and without transferring the heat to air within an enclosed chamber surrounding the cards. The enclosure (10) includes a floor (12) and a pluralit

대표청구항

1. An enclosure for protecting electronic cards from exposure to harmful elements and for dissipating internally generated heat, the enclosure comprising:a floor; and a plurality of spaced-apart card-receiving sleeves mounted to the floor, each of the sleeves configured for receiving and enclosing o

이 특허에 인용된 특허 (29)

  1. Hilbrink Johan O. (Cincinnati OH), Apparatus for cooling electronic devices.
  2. Gates Frank Vernon, Apparatus for heat removal from a PC card array.
  3. Mauclere Bernard (Maurepas FRX) Jamet Daniel (Nozay FRX), Box for transmission line repeaters.
  4. Hayes Hasler R.,CAX ; Daniels Michael H.,CAX ; Atkinson John C.,CAX, Circuit packs and circuit pack and shelf assemblies.
  5. Bulante Roderick A. ; Duncan Gary L. ; Conwell Troy A. ; Quan Dennis ; Stafford John P. ; Lee Sung H., Composite heat sink/support structure.
  6. Leyssens Francois J. C. (Mortsel BEX) Rombouts Hendrikus M. J. (Zoersel BEX), Cooling system.
  7. Saito Yoshio,JPX, Electronic apparatus having heat dissipating arrangement.
  8. Kuroda Yoshikatsu,JPX, Electronic apparatus having printed circuit board module accommodated in case thereof.
  9. Bitller Jean-Pierre (Plaisir FRX) Faucher Pascal (Longjumeau FRX) Hang-Hu Monique (Sainte Genevieve des Bois FRX) Pelet Andr (Maurepas FRX), Electronic circuit housing.
  10. Zapach Trevor,CAX ; Jeakins William D.,CAX ; Muegge Steven,CAX, Electronic unit.
  11. Beavers Roger L., Enclosure for high-density subscriber line modules.
  12. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  13. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  14. Gesklin Julio ; Kulp John H. ; Krempels Alan C., Heat sink.
  15. Sewell Mark W. (Fredericksburg VA), Heat sink device for electronics modules packaged in cylindrical casings.
  16. Baum Walter (Hanover DEX) Still Michael (Langenhagen DEX) Becker Erich (Seeheim-Jugenheim DEX), Heat-producing elements with heat pipes.
  17. Feng Hsiu-Mei,TWX, Heat-radiating structure of power adapter.
  18. Goss Steven R. (Tucson AZ) Taggart Owen H. (Tucson AZ), High density electronics package having stacked circuit boards.
  19. McCann Andrew F., Housing for electronic devices including internal fins for volumetric cooling.
  20. Pelet Andr (Maurepas FRX) Cachot Jacques (Saint Michel sur Orge FRX), Housing for submersible equipment.
  21. Bitller Jean-Pierre (Orsay FRX) Pelet Andr (Maurepas FRX) Wirth Guy (Paris FRX) Hang-Hu Monique (Saintry sur Seine FRX), Housing for underwater electronic circuits.
  22. Bartilson Bradley W., Large area, multi-device heat pipe for stacked MCM-based systems.
  23. Laetsch Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
  24. Hughes Richard P.,CAX ; Zapach Trevor G.,CAX ; Lawless Patrick T.,CAX, Mounting structure for heat conductively supporting a planar electric device.
  25. Zurek Michael W., Multiple integrated service unit for communication system.
  26. Davis Aurthur A. (Harrold Wood GB2) Eady Robert W. (London GB2), Optical repeaters.
  27. Glover Richard John,CAX ; Bishop Michael Reginald,CAX ; Tencer Michal Stefan,CAX, Packaging system for thermally controlling the temperature of electronic equipment.
  28. Perry Michael W. (Ocean NJ), Repeater housing and circuit mounting structure.
  29. Bellino Richard Anthony ; Bowers Thomas Earl ; Harrison William Thomas ; Harvey William Joseph ; Maass Paul Edwin ; Miller Joel Everett ; Miran Reynaldo Olinares, System for providing air flow control and EMC shielding of front panels of computers and similar electronic equipment.

이 특허를 인용한 특허 (21)

  1. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping case.
  2. Gustine,Gary; Ham,Charles; Kusz,Matthew J.; Sawyer,Michael, Clamping case.
  3. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping receptacle.
  4. Gustine,Gary; Ham,Charles; Kusz,Matthew; Sawyer,Michael, Clamping receptacle.
  5. Lee, Kuo-Liang, Electronic apparatus with natural convection structure.
  6. Taubert, Tomasz; Hutchison, Randall; Marosfalvy, Hans; Smith, Kevan, Expandable electronic equipment enclosure.
  7. Schiffbauer, Robert; Marosfalvy, Hans; Hutchison, Randall D.; Taubert, Tomasz; Smith, Kevan, Flexible telecommunications cable for outside plant equipment.
  8. Vos,David L.; Stutzman,Randall J.; Larcheveque,Jon; Urda,Eugene J., Flow through cooling assemblies for conduction-cooled circuit modules.
  9. Ferris, Matthew D.; Petersen, Cyle D., Heat dissipation for electronic enclosures.
  10. Krivonak, Andrew Louis; Perlaguri, Shreenath Shekar; Yammanuru, Rajendra; Radhakrishnan, Arunpandi; Brown, Theodore Clark, Heat transfer chassis and method for forming the same.
  11. Sawyer, Michael; Kusz, Matthew J.; Gustine, Gary; Ham, Charles G.; Daniels, Fredrick A., Housings for circuit cards.
  12. Laetsch, Erich K., Local loop telecommunication repeater housing having mounting slots enabling replaceable repeater and voltage protector assemblies.
  13. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick A.; Bishop, Michelle; King, Lane; Kusz, Matthew J., Mechanical housing.
  14. Gustine,Gary; Ham,Charles G.; Sawyer,Michael; Daniels,Frederick; Bishop,Michelle; King,Lane; Kusz,Matthew, Mechanical housing.
  15. Barth, Michael K.; Ham, Charles G.; Tennis, Gene; Kusz, Matthew; Sjodin, Chad J.; Ferris, Matthew; Petersen, Cyle D., Methods and systems of heat transfer for electronic enclosures.
  16. Daniels, Fredrick; Kachurick, Christopher, Protective pot or container.
  17. Bernier,Eric; Watkins,John; Algie,Glenn, Remote interface for a network device in the physical plant.
  18. O'Baid, Amr Hassan; Kunimoto, Wallace Y., Stirling cycle cryocooler with improved magnet ring assembly and gas bearings.
  19. Ghadiri Moghaddam, Davood; LePoudre, Philip Paul; Gerber, Manfred, Systems and methods for managing conditions in enclosed space.
  20. Hutchison, Randall D.; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
  21. Lin, Wanlai; Hutchison, Randall D.; Smith, Kevan; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
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