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Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/44
  • H01L-021/48
  • H01L-021/50
출원번호 US-0640801 (2000-08-17)
발명자 / 주소
  • Warren M. Farnworth
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    Traskbritt
인용정보 피인용 횟수 : 39  인용 특허 : 46

초록

A stereolithographically fabricated, substantially hermetic package. The package surrounds at least a portion of a semiconductor die so as to substantially hermetically seal the same. The substantially hermetic package may be fabricated from thermoplastic glass, other types of glass, ceramics, or me

대표청구항

1. A method for substantially hermetically packaging at least one semiconductor device, comprising:providing the at least one semiconductor device; forming a layer of unconsolidated hermetic packaging material; at least partially selectively consolidating said hermetic packaging material of said lay

이 특허에 인용된 특허 (46)

  1. Forderhase Paul F. (Austin TX) Deckard Carl R. (Round Rock TX) Klein Jack M. (Downey CA), Apparatus and method for producing parts with multi-directional powder delivery.
  2. Bredt James F., Binder composition for use in three dimensional printing.
  3. Bredt James F. (Watertown MA), Binder composition for use in three dimensional printing.
  4. Sachs Emanuel M. ; Cima Michael J. ; Bredt James F. ; Khanuja Satbir ; Yu Richard Li-chao, Ceramic mold finishing techniques for removing powder.
  5. Prinz Fritz B. (5801 Northumberland St. Pittsburgh PA 15217) Weiss Lee E. (6558 Darlington Rd. Pittsburgh PA 15217) Siewiorek Daniel P. (1259 Bellerock St. Pittsburgh PA 15217), Electronic packages and smart structures formed by thermal spray deposition.
  6. Hatchard Colin D. ; Blish ; II Richard C., Electrophoretic coating methodology to improve internal package delamination and wire bond reliability.
  7. Sachs Emanuel ; Michaels Steven P. ; Allen Samuel M., Enhancement of thermal properties of tooling made by solid free form fabrication techniques.
  8. Francis Gaylord L. (Painted Post NY), Fusion sealing materials.
  9. Farnworth Warren M. (Nampa ID) Akram Salman (Boise ID) Wood Alan G. (Boise ID), Hermetic chip and method of manufacture.
  10. Farnworth Warren M. ; Akram Salman ; Wood Alan G., Hermetic chip and method of manufacture.
  11. Deckard Carl R. (Austin TX), Method and apparatus for producing parts by selective sintering.
  12. Deckard Carl R. (Austin TX), Method and apparatus for producing parts by selective sintering.
  13. Deckard Carl R. (Austin TX), Method and apparatus for producing parts by selective sintering.
  14. Helbig Klaus (Berlin DEX) Geissler Roland (Dresden DEX) Wulst Norbert (Bischofswerda DEX), Method and apparatus for the enlargement of the reach of the transmission channel between functional groups of an ISDN-u.
  15. Asada Haruhiko (Concord MA) Pil Anton C. (Cambridge MA), Method and apparatus for the recursive design of physical structures.
  16. Deckard Carl R. (Round Rock TX), Method for producing parts.
  17. Sloan James W. (Austin TX) Tran Truoc T. (Austin TX) Jones ; III Frank T. (Austin TX), Method for providing alpha particle protection for an integrated circuit die.
  18. Leyden Richard N. ; Hull Charles W., Method for selective deposition modeling.
  19. Deckard Carl R. (1801 Pin Oak La. Round Rock TX 78681) Beaman Joseph J. (700 Texas Ave. Austin TX 78705) Darrah James F. (4906 Manchaca Austin TX 78745), Method for selective laser sintering with layerwise cross-scanning.
  20. Lakshminarayan Udaykumar ; McAlea Kevin P. ; Booth Richard B., Method of forming three-dimensional articles using thermosetting materials.
  21. Barlow Joel W. (Austin TX) Vail Neal K. (Austin TX), Method of producing high-temperature parts by way of low-temperature sintering.
  22. Marcus Harris L. (Austin TX) Lakshminarayan Udaykumar (Austin TX) Bourell David L. (Austin TX), Method of producing parts by selective beam interaction of powder with gas phase reactant.
  23. Dickens ; Jr. Elmer D. (Richfield OH) Taylor Glenn A. (Twinsburg OH) Kunig Frederic W. (Akron OH) Magistro Angelo J. (Brecksville OH) Weissman Eric M. (Chagrin Falls OH) Hradek Timothy R. (Cleveland , Method of recovering recyclable unsintered powder from the part bed of a selective laser-sintering machine.
  24. Farnworth Warren M. (Boise ID), Micro-pillar fabrication utilizing a stereolithographic printing process.
  25. Bourell David L. (Austin TX) Marcus Harris L. (Austin TX) Barlow Joel W. (Austin TX) Beaman Joseph J. (Austin TX) Deckard Carl R. (Austin TX), Multiple material systems for selective beam sintering.
  26. Knowlton R. Helene (Houston TX), Optimized PDC cutting shape.
  27. Cima Linda G. (Lexington MA) Cima Michael J. (Lexington MA), Preparation of medical devices by solid free-form fabrication methods.
  28. Cima Linda G. ; Cima Michael J., Preparation of medical devices by solid free-form fabrication methods.
  29. Heffner Kenneth H. ; Anderson Curtis W., Process for coating an integrated circuit device with a molten spray.
  30. Sachs Emanuel M. (Somerville MA) Cima Michael J. (Lexington MA) Bredt James F. (Watertown MA) Khanuja Satbir (Cambridge MA), Process for removing loose powder particles from interior passages of a body.
  31. Farnworth Warren M. ; Wood Alan G., Process of making a glass semiconductor package.
  32. Grube Kris W. (Austin TX) Beaman Joseph J. (Austin TX), Radiant heating apparatus for providing uniform surface temperature useful in selective laser sintering.
  33. Cornelius Lauren K. (Painted Post NY) Francis Gaylord L. (Painted Post NY) Tick Paul A. (Corning NY), Sealing materials and glasses.
  34. Bourell David L. (Austin TX) Marcus Harris L. (Austin TX) Weiss Wendy L. (Socorro NM), Selective laser sintering of parts by compound formation of precursor powders.
  35. McAlea Kevin P. ; Forderhase Paul F. ; Booth Richard B., Selective laser sintering of polymer powder of controlled particle size distribution.
  36. McAlea Kevin P. ; Forderhase Paul F. ; Ganninger Mark E. ; Kunig Frederic W. ; Magistro Angelo J., Selective laser sintering with composite plastic material.
  37. Karpman Maurice S. (Austin TX), Semiconductor device having a low temperature UV-cured epoxy seal.
  38. Lee Biing-Lin (Broadview Heights OH), Sinterable mass of polymer powder having resistance to caking and method of preparing the mass.
  39. Dickens ; Jr. Elmer Douglas (Richfield OH) Lee Biing Lin (Broadview Heights OH) Taylor Glenn Alfred (Houston TX) Magistro Angelo Joseph (Brecksville OH) Ng Hendra (E. Cleveland OH) McAlea Kevin P. (A, Sinterable semi-crystalline powder and near-fully dense article formed therein.
  40. Dickens ; Jr. Elmer D. (Richfield OH) Lee Biing L. (Broadview Heights OH) Taylor Glenn A. (Twinsburg OH) Magistro Angelo J. (Brecksville OH) Ng Hendra (E. Cleveland OH) McAlea Kevin (Austin TX) Forde, Sinterable semi-crystalline powder and near-fully dense article formed therewith.
  41. Dickens ; Jr. Elmer D. (Richfield OH) Lee Biing Lin (Broadview Heights OH) Taylor Glenn A. (Twinsburg OH) Magistro Angelo J. (Brecksville OH) Ng Hendra (E. Cleveland OH), Sinterable semi-crystalline powder and near-fully dense article formed therewith.
  42. Beaman Joseph J. (Austin TX) McGrath Joseph C. (Calistoga CA) Prioleau Frost R. R. (Piedmont CA), Thermal control of selective laser sintering via control of the laser scan.
  43. Sachs Emanuel ; Curodeau Alain ; Fan Tailin ; Bredt James F. ; Cima Michael ; Brancazio David, Three dimensional printing system.
  44. Cima Michael (Lexington MA) Sachs Emanuel (Somerville MA) Fan Tailin (Cambridge MA) Bredt James F. (Watertown MA) Michaels Steven P. (Melrose MA) Khanuja Satbir (Cambridge MA) Lauder Alan (Boston MA), Three-dimensional printing techniques.
  45. Sachs Emanuel M. (Somerville MA) Haggerty John S. (Lincoln MA) Cima Michael J. (Lexington MA) Williams Paul A. (Concord MA), Three-dimensional printing techniques.
  46. Cima Linda G. (Lexington MA) Cima Michael J. (Lexington MA), Tissue regeneration matrices by solid free form fabrication techniques.

이 특허를 인용한 특허 (39)

  1. Benson, Peter A., Apparatus for spin coating semiconductor substrates.
  2. Farnworth,Warren M., Apparatus for stereolithographic processing of components and assemblies.
  3. Farnworth, Warren M., Electronic device package structures.
  4. Wood,Alan G.; Doan,Trung Tri, Method for fabricating semiconductor component with thinned substrate having pin contacts.
  5. Farnworth,Warren M.; Wood,Alan G.; Hiatt,William M.; Wark,James M.; Hembree,David R.; Kirby,Kyle K.; Benson,Pete A., Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts.
  6. Farnworth,Warren M., Method of forming conductive bumps.
  7. Farnworth,Warren M.; Wood,Alan G., Methods for forming protective layers on semiconductor device substrates.
  8. Grigg, Ford B.; Ocker, James M.; Leininger, Rick A., Methods for labeling semiconductor device components.
  9. Farnworth, Warren M., Methods for stereolithographic processing of components and assemblies.
  10. Wood, Alan G.; Farnworth, Warren M.; Hembree, David R.; Rigg, Sidney B.; Hiatt, William M.; Benson, Peter; Kirby, Kyle K.; Akram, Salman, Methods for thinning semiconductor substrates that employ support structures formed on the substrates.
  11. Farnworth,Warren M.; Kirby,Kyle K.; Hiatt,William M., Methods of coating and singulating wafers.
  12. Wood, Alan G.; Farnworth, Warren M.; Watkins, Charles M.; Benson, Peter A., Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material.
  13. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A., Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials.
  14. Peterson, Darin L.; Wensel, Richard W.; Lee, Choon Kuan; Faull, James A., Microelectronic component assemblies having exposed contacts.
  15. Wood,Alan G.; Farnworth,Warren M.; Watkins,Charles M.; Benson,Peter A., Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same.
  16. Akram, Salman, SEMICONDUCTOR DEVICE INCLUDING LEADS IN COMMUNICATION WITH CONTACT PADS THEREOF AND A STEREOLITHOGRAPHICALLY FABRICATED PACKAGE SUBSTANTIALLY ENCAPSULATING THE LEADS AND METHODS FOR FABRICATING THE S.
  17. Wood,Alan G.; Doan,Trung Tri, Semiconductor component and assembly having female conductive members.
  18. Klein,Dean A.; Wood,Alan G.; Doan,Trung Tri, Semiconductor component having multiple stacked dice.
  19. Farnworth,Warren M.; Wood,Alan G.; Hiatt,William M.; Wark,James M.; Hembree,David R.; Kirby,Kyle K.; Benson,Pete A., Semiconductor component having plate, stacked dice and conductive vias.
  20. Farnworth,Warren M.; Wood,Alan G.; Doan,Trung Tri, Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts.
  21. Akram, Salman, Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof.
  22. Hembree,David R.; Farnworth,Warren M., Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material.
  23. Akram, Salman, Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same.
  24. Akram,Salman, Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same.
  25. Farnworth,Warren M.; Wood,Alan G., Semiconductor devices including protective layers on active surfaces thereof.
  26. Benson,Peter A., Semiconductor wafer assemblies.
  27. Farnworth, Warren M.; Johnson, Mark S., Stereolithographic method and apparatus for packaging electronic components.
  28. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  29. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  30. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  31. Farnworth, Warren M., Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages.
  32. Farnworth, Warren M.; Wood, Alan G., Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed.
  33. Akram, Salman, Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed.
  34. Farnworth, Warren M.; Duesman, Kevin G, Surface smoothing of stereolithographically formed 3-D objects.
  35. Farnworth,Warren M.; Duesman,Kevin G., Surface smoothing of stereolithographically formed 3-D objects.
  36. Klein,Dean A.; Wood,Alan G.; Doan,Trung Tri, System having semiconductor component with multiple stacked dice.
  37. Lau,Daniel K.; Law,Edward L. T., Thermal enhanced package for block mold assembly.
  38. Hembree, David R.; Farnworth, Warren M., Underfill and encapsulation of semiconductor assemblies with materials having differing properties.
  39. Benson,Peter A., Wafer edge ring structures and methods of formation.
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