초록 ▼

A three-dimensional multichip module having a base structure formed by a plurality of chips secured together in a stack and a plurality of exterior chips mounted to the exterior faces of the base structure. The multichip module may incorporate memory chips, processor chips, logic chips, A to D conve

A three-dimensional multichip module having a base structure formed by a plurality of chips secured together in a stack and a plurality of exterior chips mounted to the exterior faces of the base structure. The multichip module may incorporate memory chips, processor chips, logic chips, A to D converter chips, and other chips in a compact package. The module permits chips that require extensive cooling to be positioned within the structure in a manner such that a large surface area of the chip is not in contact with other chips. The module also permits extensive interconnection between chips within the module.

대표청구항 ▼

1. A multichip module comprising:a plurality of semiconductor chips stacked and secured together to form a base structure wherein the base structure has a first lateral face that is comprised of a portion of each chip; an exterior semiconductor chip mounted to the first lateral face of the base stru

1. A multichip module comprising:a plurality of semiconductor chips stacked and secured together to form a base structure wherein the base structure has a first lateral face that is comprised of a portion of each chip; an exterior semiconductor chip mounted to the first lateral face of the base structure in a manner such that a first surface of the exterior chip is positioned adjacent to the first lateral face and extends across at least a portion of the first lateral face.