초록 ▼

This invention relates to a system and method for reclosing a package. A package reclosure is provided with a top layer having a perforation and a carrier substrate. A folded substrate or folded member is provided between the carrier substrate and top layer. The folded member is only secured to the

This invention relates to a system and method for reclosing a package. A package reclosure is provided with a top layer having a perforation and a carrier substrate. A folded substrate or folded member is provided between the carrier substrate and top layer. The folded member is only secured to the top layer such that, when the perforation is torn, a portion of the folded member may be unfolded to reveal a repositionable adhesive which is used to retain an end of the package in a closed position.

대표청구항 ▼

1. A package reclosure comprising:a top layer having a first adhesive layer and a perforation; a folded substrate that is folded to define at least a first inward side and a second inward side and a first outward side and second outward side, said first and second outward sides being opposite said f

1. A package reclosure comprising:a top layer having a first adhesive layer and a perforation; a folded substrate that is folded to define at least a first inward side and a second inward side and a first outward side and second outward side, said first and second outward sides being opposite said first and second inward sides, respectively; said first outward side being secured to said first adhesive layer; and a carrier substrate comprising a first side and a second side, said second side being secured to a first release liner with a second adhesive layer; said second inward side of said folded substrate comprising a third adhesive layer having a second release liner secured thereto; said folded substrate being folded such that said folded substrate can be unfolded when said perforation is broken to permit said release liner to be removed from said third adhesive layer to permit a user to reclose said package.