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Curing catalyst, resin composition, resin-sealed semiconductor device and coating material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08G-059/68
출원번호 US-0334915 (1999-06-17)
우선권정보 JP-0170323 (1998-06-17); JP-0352908 (1998-12-11)
발명자 / 주소
  • Shinji Murai JP
  • Shuji Hayase JP
  • Shinetsu Fujieda JP
  • Rumiko Hayase JP
  • Yasuyuki Hotta JP
출원인 / 주소
  • Kabushiki Kaisha Toshiba JP
대리인 / 주소
    Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
인용정보 피인용 횟수 : 5  인용 특허 : 21

초록

A curing catalyst comprising at least one of a cationic curing catalyst component and an organo-metallic compound component. At least one of these components is capable of reversibly repeating the dissolution and precipitation through heating and cooling. The cationic curing catalyst component inclu

대표청구항

1. A curing catalyst comprising:an organometallic compound component capable of reversibly dissolving and precipitating through heating and cooling, and selected from the group consisting of the following formulas (II-1), (II-2) and (II-3); and at least one compound selected from the group consistin

이 특허에 인용된 특허 (21)

  1. Tramontano Valentino J. (Fairfield CT) Lapkin Milton (Beverly Farms MA) Rothenberger Scott D. (Derry NH), Aqueous coating compositions.
  2. Hayase Shuzi,JPX ; Nakano Yoshihiko,JPX ; Murai Shinji,JPX ; Mikogami Yukihiro,JPX, Aromatic curing catalyst for epoxy resins.
  3. Kolthammer Brian W. S. (Lake Jackson TX) Cardwell Robert S. (Lake Jackson TX) Tracy John C. (Lake Jackson TX), Catalyst composition.
  4. Lamanna William M. (Stillwater MN) Palazzotto Michael C. (St. Paul MN) DeVoe Robert J. (Oakdale MN) McCormick Fred B. (Maplewood MN) Olofson Jeffrey M. (Woodbury MN) Siedle Allen R. (Lake Elmo MN) Wi, Catalysts and initiators for polymerization.
  5. Lamanna William M. (Stillwater MN) Palazzotto Michael C. (Woodbury MN) Mahoney Wayne S. (St. Paul MN) Kropp Michael A. (Cottage Grove MN), Energy-activatable salts with fluorocarbon anions.
  6. Wada Moriyasu (Kanagawa JPX) Suzuki Shuichi (Yokohama JPX) Ito Takeo (Kawasaki JPX) Hayase Shuzi (Yokohama JPX), Epoxy resin-based compositions.
  7. Karim Naimul ; George Clayton A. ; Meyer Christopher M., Epoxy/thermoplastic photocurable adhesive composition.
  8. Morimoto Kotaro (Hiratsuka JPX) Kawamura Chicara (Hiratsuka JPX) Nakai Noboru (Isehara JPX) Aida Haruhiko (Hiratsuka JPX) Takoh Noboru (Hiratsuka JPX) Ito Satoru (Kanagawa-ken JPX), Hydroxyl-containing polyester, polyepoxide and silicon compound.
  9. Smith James D. B. (Wilkins Township ; Allegheny County PA) Kauffman Robert N. (Monroeville PA), Latent accelerators for curing epoxy resins.
  10. Nakamura Akito,JPX ; Tsuji Yuichi,JPX, Liquid silicone rubber coating composition.
  11. Marutani Yoshiaki,JPX ; Nakahama Tadamitsu,JPX ; Sasaki Shinji,JPX ; Uemura Hiroyuki,JPX ; Koga Kazuhi,JPX ; Tomita Takashi,JPX ; Ohsawa Mika,JPX, Low solvent composition of alicyclic epoxy oligomer.
  12. Staral John S. ; Karim Naimul ; Isberg Thomas A. ; Smith Terrance P. ; Kinzer Kevin E., Method for assembling layers with a transfer process using a crosslinkable adhesive layer.
  13. Loiselle Brian P. (Midland MI) VanWert Bernard (Midland MI), Moisture curable organosiloxane coating compositions.
  14. Martin David L. (Midland MI), Molding process using room temperature curing silicone coatings to provide multiple release of articles.
  15. Chu Hsien-Kun (Wethersfield Township ; Hartford County CT) Kamis Russell P. (Willard Township ; County of Bay MI) Klosowski Jerome M. (Monitor Township ; County of Bay MI) Lower Loren D. (Midland MI), Neutral cure silicone sealants.
  16. Perez Mario A. ; Ylitalo David A. ; Clausen Thomas M. ; DeVoe Robert J. ; Kinzer Kevin E. ; Swan Michael D., Semi-interpenetrating polymer networks of epoxy and polyolefin resins, methods therefor, and uses thereof.
  17. Kinzer Kevin E. (Woodbury MN) Mahoney Wayne S. (St. Paul MN) Palazzotto Michael C. (Ramsey MN), Stabilized curable adhesives.
  18. Karim Naimul ; Kinzer Kevin E. ; Everaerts Albert I. ; Halm Leo W. ; Keipert Steven J. ; Williams Jerry W., Stable, low cure-temperature semi-structural pressure sensitive adhesive.
  19. Kolthammer Brian W. S. ; Tracy John C. ; Cardwell Robert S. ; Rosen Robert K., Supported catalyst complexes for olefin in polymerization.
  20. Ikushima Satoshi,JPX ; Okumura Yasumasa,JPX ; Isozaki Osamu,JPX ; Tsunoda Minoru,JPX, Thermosetting compositions and methods of forming a finish coat.
  21. Koyama Tohru (Hitachi JPX) Takasaki Hirokazu (Hitachi JPX) Suzuki Hiroshi (Hitachi JPX) Amagi Shigeo (Ibaraki JPX) Mukoh Akio (Mito JPX) Kano Ikushi (Ibaraki JPX), Thermosetting resin composition for casting high-voltage coil, and molded coil and panel formed by casting and curing th.

이 특허를 인용한 특허 (5)

  1. Matsushima, Takayuki, Adhesive and electric device.
  2. Takai, Hideyuki; Miyake, Hiroto; Maruo, Katsuya, Curable resin composition, a method for the preparation thereof, and a coated article thereof.
  3. Lu,Qiwei; O'Brien,Michael; Vallance,Michael, Molding composition and method, and molded article.
  4. Morita, Yoshitsugu; Kato, Tomoko, Optical semiconductor device and method of manufacturing thereof.
  5. Jennrich,Irene; Leo,Kristian; Muzic,Markus; Endres,Wolfgang; Greif,Hubert, Silicone-modified single-component casting compound.
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