초록 ▼

Disclosed is a multilayer electronics packaging structure, especially for use in a multi chip module. By forming an overlap of signal conductors by the respective mesh conductors, an improved shielding effect is achieved and coupling between signal conductors is reduced. By increasing the via punch

Disclosed is a multilayer electronics packaging structure, especially for use in a multi chip module. By forming an overlap of signal conductors by the respective mesh conductors, an improved shielding effect is achieved and coupling between signal conductors is reduced. By increasing the via punch pitch such that multiple wiring channels are formed between adjacent vias, wirability is improved and the number of signal distribution layers may be reduced. The new structure thus shows improved electrical properties over the state-of-the-art structures, combined with a cost reduction of about 35%.

대표청구항 ▼

1. A multilayer module for packaging at least one electronic component, said module comprising;a plurality of electrically insulative layers; a plurality of electrically conductive layers, each of said electrically conductive layers being disposed between subsequent ones of said electrically insulat

1. A multilayer module for packaging at least one electronic component, said module comprising;a plurality of electrically insulative layers; a plurality of electrically conductive layers, each of said electrically conductive layers being disposed between subsequent ones of said electrically insulative layers, said electrically conductive layers forming; mesh planes comprising mesh conductors, said mesh planes being either voltage mesh planes or ground mesh planes; signal distribution layers comprising signal conductors, one or more of said signal distribution layers being disposed between said mesh planes, said mesh conductors being wider than said signal conductors; signal and power vias, said vias forming conductive paths through said insulative layers and said conductive layers, said vias having a predetermined via pitch creating a plurality of wiring channels between adjacent ones of said vias on each of said conductive layers.