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Packaging of electro-microfluidic devices

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F16K-027/00
출원번호 US-0790423 (2001-02-21)
발명자 / 주소
  • Gilbert L. Benavides
  • Paul C. Galambos
  • John A. Emerson
  • Kenneth A. Peterson
  • Rachel K. Giunta
  • Robert D. Watson
출원인 / 주소
  • Sandia Corporation
대리인 / 주소
    Robert D. Watson
인용정보 피인용 횟수 : 50  인용 특허 : 4

초록

A new architecture for packaging surface micromachined electro-microfluidic devices is presented. This architecture relies on two scales of packaging to bring fluid to the device scale (picoliters) from the macro-scale (microliters). The architecture emulates and utilizes electronics packaging techn

대표청구항

1. A package for housing an electro-microfluidic device comprising:a substantially planar substrate having an upper surface, and an opposing lower surface; a first fluidic opening disposed on the upper surface of the substrate; a second fluidic opening disposed on the lower surface of the substrate;

이 특허에 인용된 특허 (4)

  1. Packard Warren J. (Chicago IL) Jerman John H. (Palo Alto CA), Electrofluidic standard module and custom circuit board assembly.
  2. Loux Alan D. ; Higdon William R. ; Slater Timothy G., Housing assembly for micromachined fluid handling structure.
  3. Mastrangelo Carlos H. ; Man Piu F. ; Webster James R., Polymer-based micromachining for microfluidic devices.
  4. Higdon William R. ; Loux Alan D., Selector valve assembly.

이 특허를 인용한 특허 (50)

  1. Dimeo, Jr., Frank; Chen, Philip S. H.; Neuner, Jeffrey W.; Welch, James; Stawasz, Michele; Baum, Thomas H.; King, Mackenzie E.; Chen, Ing-Shin; Roeder, Jeffrey F., Apparatus and process for sensing fluoro species in semiconductor processing systems.
  2. Dimeo, Jr.,Frank; Chen,Philip S. H.; Neuner,Jeffrey W.; Welch,James; Stawacz,Michele; Baum,Thomas H.; King,Mackenzie E.; Chen,Ing Shin; Roeder,Jeffrey F., Apparatus and process for sensing fluoro species in semiconductor processing systems.
  3. Dimeo, Jr.,Frank; Chen,Philip S. H.; Neuner,Jeffrey W.; Welch,James; Stawasz,Michele; Baum,Thomas H.; King,Mackenzie E.; Chen,Ing Shin; Roeder,Jeffrey F., Apparatus and process for sensing fluoro species in semiconductor processing systems.
  4. Nystrom, Peter J; Sahu, Bijoyraj, Bonded silicon structure for high density print head.
  5. Horning, Robert D., Bonding system having stress control.
  6. Tang, Zhongliang; Tsinberg, Pavel; Bhatt, Ram S., Cell separation using microchannel having patterned posts.
  7. Theuss, Horst, Chip-packaging module for a chip and a method for forming a chip-packaging module.
  8. Zollo, James A.; Arledge, John K.; Barron, John C.; Burhance, Gary R.; Holley, John; Liebman, Henry F., Circuit board with embedded components and method of manufacture.
  9. Brown,Stephen B.; Rawnick,James J., Controlling a phase delay line by adding and removing a fluidic dielectric.
  10. Tsinberg, Pavel; Tang, Zhongliang, Device for cell separation and analysis and method of using.
  11. Polsky, Ronen; Miller, Philip Rocco; Edwards, Thayne L., Diagnostic/drug delivery “sense-respond” devices, systems, and uses thereof.
  12. Meier, Lorenz; Hornung, Mark; Monnin, Eric; Mayer, Felix, Flow detector with a housing.
  13. Kleinlogel, Christoph; Steiner-Vanha, Ralph; Mayer, Felix, Flow sensor and method for producing the same.
  14. Fannasch, Lothar; Irle, Henning, Inductive sensor device with at least one coil.
  15. Facer, Geoffrey; Grossman, Robert; Unger, Marc; Lam, Phillip; Chou, Hou-Pu; Kimball, Jake; Pieprzyk, Martin; Daridon, Antoine, Integrated chip carriers with thermocycler interfaces and methods of using the same.
  16. Facer, Geoffrey; Grossman, Robert; Unger, Marc; Lam, Phillip; Chou, Hou-Pu; Kimball, Jake; Pieprzyk, Martin; Daridon, Antoine, Integrated chip carriers with thermocycler interfaces and methods of using the same.
  17. Facer, Geoffrey; Grossman, Robert; Unger, Marc; Lam, Phillip; Chou, Hou-Pu; Kimball, Jake; Pieprzyk, Martin; Daridon, Antoine, Integrated chip carriers with thermocycler interfaces and methods of using the same.
  18. Tofteberg, Terje Rosquist; Andreassen, Erik; Mielnik, Michal Marek, Lab-on-a-chip fabrication method and system.
  19. Milaninia, Kaveh M., Low-cost packaging for fluidic and device co-integration.
  20. Buuck, David C., Low-profile circuit board assembly.
  21. Kholwadwala,Deepesh K.; Johnston,Gabriel A.; Rohrer,Brandon R.; Galambos,Paul C.; Okandan,Murat, MEMS fluidic actuator.
  22. Dolan, Bryan R.; Andrews, John R.; Lin, Pinyen; Gerner, Bradley J.; DeCrescentis, Antonio, Method for facilitating assembly of a printhead having a polymer layer.
  23. Tsao,Pei Haw; Huang,Chender; Wang,Jones; Chen,Ken, Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly.
  24. Zhang, Gang; Cohen, Adam L.; Lockard, Michael S.; Kumar, Ananda H.; Kruglick, Ezekiel J. J.; Kim, Kieun, Method of electrochemically fabricating multilayer structures having improved interlayer adhesion.
  25. Walker, Christopher I.; Rajagopal, Aditya; Scherer, Axel, Methods for fabrication of microfluidic systems on printed circuit boards.
  26. Fontana, Fulvio Vittorio, Micro-electro-mechanical systems (MEMS) and corresponding manufacturing process.
  27. Fontana, Fulvio Vittorio, Micro-electro-mechanical systems (MEMS) and corresponding manufacturing process.
  28. Okandan,Murat; Galambos,Paul C.; Benavides,Gilbert L.; Hetherington,Dale L., Micro-fluidic interconnect.
  29. Okandan, Murat, Microelectromechanical flow control apparatus.
  30. Ingber, Donald E.; Levner, Daniel; Thompson, II, Guy; Hinojosa, Christopher David, Microfluidic cartridge assembly.
  31. Shaikh, Kashan Ali; Godin, Jessica Marie; Corwin, Alex David; Filkins, Robert John, Microfluidic chamber device and fabrication.
  32. Shaikh, Kashan Ali; Wang, Mengli; Larriera Moreno, Adriana Ines; Karp, Jessica Godin; Pitner, Christine Lynne, Microfluidic flow cell assemblies and method of use.
  33. Shaikh, Kashan Ali; Wang, Mengli; Larriera Moreno, Adriana Ines; Karp, Jessica Godin; Pitner, Christine Lynne, Microfluidic flow cell assemblies for imaging and method of use.
  34. Graham, Craig, Microfluidic interconnect.
  35. Samper,Victor; Cong,Lin; Ji,Hongmiao, Microfluidics packages and methods of using same.
  36. Cabuz,Eugen I.; Schwichtenberg,Jay G., Microvalve package assembly.
  37. Zollo, James A.; Arledge, John K.; Desai, Nitin B., Multilayer circuit board with embedded components and method of manufacture.
  38. Zollo,James A.; Arledge,John K.; Desai,Nitin B., Multilayer circuit board with embedded components and method of manufacture.
  39. Dimeo, Jr.,Frank; Chen,Philip S. H.; Chen,Ing Shin; Neuner,Jeffrey W.; Welch,James, Nickel-coated free-standing silicon carbide structure for sensing fluoro or halogen species in semiconductor processing systems, and processes of making and using same.
  40. Karpman,Maurice S.; Hablutzel,Nicole; Farrell,Peter W.; Judy,Michael W.; Felton,Lawrence E.; Long,Lewis, Packaged microchip with premolded-type package.
  41. Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D., Packaging of electro-microfluidic devices.
  42. Galambos, Paul C.; Benavides, Gilbert L.; Jokiel, Jr., Bernhard; Jakubczak II, Jerome F., Piston-driven fluid-ejection apparatus.
  43. Dolan, Bryan R.; Andrews, John R.; Lin, Pinyen; Gerner, Bradley J.; DeCrescentis, Antonio, Print head having a polymer layer to facilitate assembly of the print head.
  44. Higashi, Mitsutoshi, Production methods of electronic devices.
  45. Snyder, Steven Robert; Brown, Stephen B.; Rumpf, Raymond C.; Pigon, Brett; Rawnick, James J., RF delay lines with variable composition fluidic dielectric.
  46. Rawnick,James J.; Brown,Stephen B., RF phase delay lines with variable displacement fluidic dielectric.
  47. Toong, Teik Tiong; Lim, Chong Poh, Stacked leadframe packages.
  48. Chu,Chin Chou; Chen,Chien Fu; Kung,Chun Fei; Chang,Chien Cheng; Tseng,Fan Gang, Surface-tension-guided liquid transportation device.
  49. Cox, David M., Vertical clamp device.
  50. Cox, David M., Vertical clamp device.
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