초록 ▼

A cooling device using a capillary pumped loop (CPL), including a lower board having a looped groove formed on the upper surface, an upper board combined with the upper surface of the lower board to cover the groove, so that the flow path of a working fluid is provided, an evaporator which is provid

A cooling device using a capillary pumped loop (CPL), including a lower board having a looped groove formed on the upper surface, an upper board combined with the upper surface of the lower board to cover the groove, so that the flow path of a working fluid is provided, an evaporator which is provided on the flow path, and has a plurality of fine evaporating fins incorporated into the upper or lower board, and a condenser which is provided on the flow path at a predetermined distance apart from the evaporator, and has a plurality of fine condensing fins incorporated into the upper or lower board. Accordingly, a thin and small cooling device capable of performing cooling without external power can be obtained. Also, various modifications of a simple micro channel attached to an evaporator eliminate a resistance on a flow path produced by an increase in the specific volume of a working fluid due to the phase change of the working fluid, and prevent a backward flow of the working fluid due to a rapid increase in pressure. Therefore, the entire cooling system can have hydrodynamic instability.

대표청구항 ▼

1. A cooling device, comprising:a second substrate having a looped groove formed on the upper surface thereof; a first substrate combined with the upper surface of the second substrate to cover the groove, so that a flow path of a working fluid is provided; an evaporator which is provided on the flo

1. A cooling device, comprising:a second substrate having a looped groove formed on the upper surface thereof; a first substrate combined with the upper surface of the second substrate to cover the groove, so that a flow path of a working fluid is provided; an evaporator which is provided on the flow path, and has a plurality of fine evaporating fins incorporated into the first or second substrate; and a condenser which is provided on the flow path at a predetermined distance apart from the evaporator, and has a plurality of fine condensing fins incorporated into the first or second substrate.