초록 ▼

A method for improving the integrated circuits bonding firmness, whose principle is that after the later film is piled on top of the previous film, the upper surface of the later film will be affected by the previous film. Among the metal layers of the multi-level interconnection, the metal layer un

A method for improving the integrated circuits bonding firmness, whose principle is that after the later film is piled on top of the previous film, the upper surface of the later film will be affected by the previous film. Among the metal layers of the multi-level interconnection, the metal layer under and most close to the bond pad metal (the top metal layer of the multi-level interconnection) has a regular or an irregular layout pattern, which is under the predetermined regions serving as bond pad windows. These regular or irregular layout patterns result in a rough upper surface, and then improves the firmness of bond wires.

대표청구항 ▼

1. A structure for improving the firmness of bond wires, comprising:a composition layer formed on an insulator layer to serve as a part of a multi-level interconnection, said composition layer being composed with at least one conductive layer and at least one dielectric layer thereon, said conductiv

1. A structure for improving the firmness of bond wires, comprising:a composition layer formed on an insulator layer to serve as a part of a multi-level interconnection, said composition layer being composed with at least one conductive layer and at least one dielectric layer thereon, said conductive layer of said composition layer including a regular or an irregular layout pattern to obtain a rough upper surface of said dielectric layer; a bond pad conductive layer formed on said dielectric layer of said composition layer, and said bond pad conductive layer serves as a bond pad region; a passivation layer formed on said bond pad conductive layer; a plurality of bond pad windows in said passivation layer to expose said bond pad conductive layer; and a plurality of bond wires formed in said bond pad windows to couple to an external circuit.