초록 ▼

The present invention relates to a transparent conductive layered structure having a transparent substrate and a transparent conductive layer and transparent coating layer formed in succession on this substrate, used in, for instance, the front panel of CRT, etc., display devices. The main component

The present invention relates to a transparent conductive layered structure having a transparent substrate and a transparent conductive layer and transparent coating layer formed in succession on this substrate, used in, for instance, the front panel of CRT, etc., display devices. The main components of said transparent conductive layer are noble metal microparticles with a mean particle diameter of 1 to 100 nm, wherein the microparticles are made from gold and/or platinum and silver and the gold and/or platinum content is within a range exceeding 50 wt % up to 95 wt %, and a binder matrix. Moreover, the main components of the coating liquid used to form a transparent conductive layer in the production of a transparent conductive layered structure are solvent and noble metal-coated silver microparticles with a mean particle diameter of 1 to 100 nm dispersed in this solvent, wherein the surface of the silver microparticles is coated with gold or platinum only or a compound of gold and platinum and the gold and/or platinum content is within a range exceeding 50 wt % up to 95 wt %.

대표청구항 ▼

1. A coating liquid for forming a transparent conductive layer used to produce a transparent conductive layered structure having a transparent substrate and a transparent conductive layer and transparent coating layer formed in succession on this transparent substrate, comprising as its main compone

1. A coating liquid for forming a transparent conductive layer used to produce a transparent conductive layered structure having a transparent substrate and a transparent conductive layer and transparent coating layer formed in succession on this transparent substrate, comprising as its main components a solvent and noble metal-coated silver microparticles with a mean particle diameter of 1 to 100 nm dispersed in the solvent, wherein the surface of the silver microparticles is coated with gold or platinum only or a compound of gold and platinum and the gold and/or platinum content is within a range exceeding 50 wt % up to 95 wt %.