초록 ▼

A die mounting apparatus that includes: 1) a die including a bottom surface having an active region is located among the bottom surface and a first and second bond pads provided on the bottom surface outside of the active region; 2) a substrate including a top surface and protruding electrical conta

A die mounting apparatus that includes: 1) a die including a bottom surface having an active region is located among the bottom surface and a first and second bond pads provided on the bottom surface outside of the active region; 2) a substrate including a top surface and protruding electrical contacts that are electrically coupled to the first and second bond pads; and 3) a first encapsulant circumscribing a periphery of the die, where the first encapsulant, the bottom surface of the die, and the top surface of the substrate define a free space. The first encapsulant extends inwards from the periphery of the die towards the active region but does not contact the active region. Advantageously, the first encapsulant forms a seal around the die to protect its active region from the environment. A further advantage is that the first encapsulant provides added security that bond pads of the die will remain in contact with contacts formed among the substrate even after distortion of the shape of the die.

대표청구항 ▼

1. A mounting for a surface acoustical wave ("SAW") device comprising:a SAW device including a first surface having an active region, a first conductive pad, and a second conductive pad, wherein said first and second conductive pads are located on said first surface and on opposite ends of said acti

1. A mounting for a surface acoustical wave ("SAW") device comprising:a SAW device including a first surface having an active region, a first conductive pad, and a second conductive pad, wherein said first and second conductive pads are located on said first surface and on opposite ends of said active region; a substrate including a continuous first surface, said first surface having conductive contacts thereon; a first conductive connection between said first conductive pad and a corresponding contact on said first surface of said substrate; a second conductive connection between said second conductive pad and a corresponding contact on said first surface of said substrate; and a first encapsulant contacting and circumscribing a periphery of said SAW device, wherein said first encapsulant, said first surface of said SAW device, and said continuous first surface of said substrate define a free space, and said first encapsulant extends inwards along said first surface of said SAW device from the periphery of said SAW device towards said active region but does not contact said active region or said first and second conductive connections.