초록 ▼

A land grid array (LGA) cooling assembly and method of a cooling member assembly are provided. The LGA assembly includes a card, a module electrically connected to the card, a plurality of load posts operably attached to the card, a load frame operably attached to the load posts, and a cooling membe

A land grid array (LGA) cooling assembly and method of a cooling member assembly are provided. The LGA assembly includes a card, a module electrically connected to the card, a plurality of load posts operably attached to the card, a load frame operably attached to the load posts, and a cooling member operably attached to the load frame to allow removal of the cooling member from the assembly without disrupting the electrical connection between the module and the card. The method of assembling a land grid array cooling member assembly includes electrically connecting a module and a card, operably connecting a load frame to the card, and removably attaching a cooling member the load frame without affecting the electrical connection between the module and the card.

대표청구항 ▼

1. A land grid array (LGA) cooling assembly electrically connecting a land grid array (LGA) module to a circuit card; the LGA cooling assembly comprising:a load frame contacting an outer periphery of a top surface of the LGA module and clamping the module between the load frame and the card; a plura

1. A land grid array (LGA) cooling assembly electrically connecting a land grid array (LGA) module to a circuit card; the LGA cooling assembly comprising:a load frame contacting an outer periphery of a top surface of the LGA module and clamping the module between the load frame and the card; a plurality of load posts operably attached to the card, extending outward from the card past the module, and engaging the load frame for clamping the module in electrical contact with the card; the load frame having an opening therein exposing a portion of the top surface of the module within the outer periphery of the top surface of the module; a cooling member having a pedestal extending therefrom through the opening in the load frame providing thermally conductive contact between the pedestal and the exposed portion of the top surface of the module; and means for attaching the cooling member to the load frame and urging the pedestal in to and out of thermally conductive contact with the exposed portion of the top surface of the module, without rotation of the cooling module in relation to the load frame and module, thereby allowing the cooling member to be attached and detached from the load frame without disturbing the electrical connection of the module with the card and without imposing rotational forces against the exposed top surface of the module.