초록 ▼

A semiconductor processing system having a holding chamber coupled to a mainframe processing system and at least one loadlock chamber coupled to the holding chamber in which unprocessed wafers are transferred from the loadlock chamber to the holding chamber for subsequent processing by the mainframe

A semiconductor processing system having a holding chamber coupled to a mainframe processing system and at least one loadlock chamber coupled to the holding chamber in which unprocessed wafers are transferred from the loadlock chamber to the holding chamber for subsequent processing by the mainframe system. In one embodiment, the holding chamber has a transfer robot which holds a stack of wafers for subsequent transfer to the processing chambers of the mainframe processing system.

대표청구항 ▼

1. A semiconductor workpiece processing system, comprising:a mainframe chamber having at least one pair of adjacent processing chambers coupled to said mainframe chamber; a pressure-tight holding chamber coupled to said mainframe chamber; a first pressure-tight cassette chamber having a first casset

1. A semiconductor workpiece processing system, comprising:a mainframe chamber having at least one pair of adjacent processing chambers coupled to said mainframe chamber; a pressure-tight holding chamber coupled to said mainframe chamber; a first pressure-tight cassette chamber having a first cassette and coupled to said holding chamber; a first transfer robot positioned in said holding chamber and adapted to transfer a stack of workpieces simultaneously from said first cassette chamber to said holding chamber to be held in a first stack for subsequent transfer to said mainframe chamber; a second pressure-tight cassette chamber having a second cassette and coupled to said holding chamber; a second transfer robot positioned in said holding chamber and adapted to transfer a stack of workpieces simultaneously from said second cassette to said holding chamber to be held in a second stack for subsequent transfer to said mainframe chamber; and a third transfer robot positioned in said mainframe chamber and adjacent to said holding chamber and adapted to extend into said holding chamber and pick up a pair of workpieces from said first and second stacks of workpieces in said holding chamber. and transfer two workpieces at a time from said first and second stacks of workpieces in said holding chamber and into said pair of adjacent processing chambers wherein said pair of workpieces comprises a workpiece from each of said first and second stacks of workpieces.