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Molded image sensor package 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
출원번호 US-0457505 (1999-12-08)
발명자 / 주소
  • Steven Webster
출원인 / 주소
  • Amkor Technology, Inc.
대리인 / 주소
    Gunnison, McKay & Hodgson, L.L.P.
인용정보 피인용 횟수 : 28  인용 특허 : 22

초록

An image sensor package includes a molding having an interior locking feature and an exterior locking feature. The molding is a low cost molded part. The image sensor package further includes a window having an interior surface and an exterior surface. The exterior locking feature of the molding con

대표청구항

1. A structure comprising:a molding comprising: an interior locking feature; an exterior locking feature; and a base, wherein said molding is integral; a window having an interior surface and an exterior surface, said exterior locking feature contacting a periphery of said exterior surface, said int

이 특허에 인용된 특허 (22)

  1. Runyan Daniel (Hickmans) Irons Gary J. (Lincoln) Edds Thomas A. (Lincoln NE), Circuit breaker auxiliary device snap-on package and method of assembling same.
  2. Cassarly James W. (Huntingdon PA) Rollings Robert W. (Huntingdon PA) Youngfleish Frank C. (Pennsylvania Furnace PA), Connector mounting for integrated circuit chip packages.
  3. Okuaki Hiroshi (Tokyo JPX), EPROM device.
  4. Fusaroli Marzio (Milan ITX) Ceriati Laura (Sesto S. Giovanni ITX), EPROM semiconductor device erasable with ultraviolet rays and manufacturing process thereof.
  5. Benasutti John E. (Lansdale PA), Electrical connector assembly for an integrated circuit package.
  6. Saito Jun (Tokyo JPX), Electronic component socket.
  7. Murano Shunji (Yokaichi JPX) Miyauchi Kouji (Oumihachiman JPX) Taguchi Akira (Oumihachiman JPX) Shirao Kazuhiko (Oumihachiman JPX), Image device having a spacer with image arrays disposed in holes thereof.
  8. Murano Shunji (Aira JPX), Image devices.
  9. Beaman Bryan A. ; Gerstenberger Julie K. ; Orlicki David M., Imager package substrate.
  10. Walton R. Thomas (Torrance CA) Hathaway James A. (Redondo Beach CA) Runyan Michael D. (Torrance CA) Turnage Michael L. (Sunnymead CA), Integrated circuit package carrier.
  11. Walton R. Thomas (Torrance CA), Integrated circuit package carrier and test device.
  12. Kamata Kazuo,JPX, Lens-fitted film unit with plastic taking lens.
  13. Shimomura Jun (Tokyo JA), Light receiving device for photoelectric conversion element.
  14. Fukushima Tetsuo (Hirakata JPX) Otsuki Toshinori (Yawata JPX) Okada Shinji (Neyagawa JPX) Seutsugu Kenichiro (Amagasaki JPX), Method of molding a lens array.
  15. Glenn Thomas P. ; Webster Steven, Molded window array for image sensor packages.
  16. Glenn Thomas P., Mounting for a semiconductor integrated circuit device.
  17. Glenn Thomas P., Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device.
  18. Campbell Hugh P. ; Behringer Rheinhold W., Precision optical sensor packaging.
  19. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA), Protective carrier and securing means therefor.
  20. Chapnik Philip (Newton MA), Spatially multiplexed image display system.
  21. Clover George R. (London GB2), Transparency viewers.
  22. Hodges Joe (Boise ID), UV light sensitive die-pac for securing semiconductor dies during transport.

이 특허를 인용한 특허 (28)

  1. Webster,Steven, Camera module fabrication method including singulating a substrate.
  2. Webster,Steven, Camera module fabrication method including the step of removing a lens mount and window from the mold.
  3. Webster,Steven, Camera module having a threaded lens barrel and a ball grid array connecting device.
  4. Glenn, Thomas P.; Webster, Steven, Camera module with window mechanical attachment.
  5. Humpston, Giles, Compact lens turret assembly.
  6. Webster, Steven, Image sensor package.
  7. Park,Sung Soon; Kim,Jin Seong; Kim,Young Ho, Image sensor package and method for manufacture thereof.
  8. Tsai,Ming Chiang; Lee,Chun Yu; Jiang,Tsung Wei, Image sensor package and system.
  9. Webster, Steven, Image sensor package fabrication method.
  10. Hsieh, Jackson; Wu, Jichen; Chen, Bruce; Chang, Kevin, Injection molded image sensor and a method for manufacturing the same.
  11. Yagi,Shigeru; Suzuki,Seiji; Kurita,Takashi; Yamamoto,Shizuo, Light detection device and mounting method thereof.
  12. Kojima,Kazuaki; Hamada,Minoru, Method for manufacturing a solid-state image sensing device, such as a CCD.
  13. Sasaki,Kaoru; Yamamoto,Keiji, Method for manufacturing semiconductor device.
  14. Glenn, Thomas P.; Webster, Steven, Method of fabricating and using an image sensor package.
  15. Huemoeller, Ronald P.; Sheridan, Richard P., Method of making a chip carrier package using laser ablation.
  16. Haskett, Bradley Morgan; O'Connor, John Patrick; Miller, Mark Myron; Crowley, Sean Timothy; Miks, Jeffrey Alan; Popovich, Mark Phillip, Micro-optical device packaging system.
  17. Webster, Steven, Molded image sensor package and method.
  18. Webster, Steven, Molded semiconductor package.
  19. Webster, Steven, Molded semiconductor package with snap lid.
  20. Tseng, Chi Wang, Optical signal receiving device.
  21. Blümel, Simon, Optoelectronic module, and method for the production thereof.
  22. Zimmerman, Michael A.; Smith, Keith; Shverdin, Jacob, Plastic electronic component package.
  23. Horikoshi, Katsu; Uchiyama, Hisayoshi; Noma, Takashi; Seki, Yoshinori; Yamada, Hiroshi; Ishibe, Shinzo; Shinogi, Hiroyuki, Semiconductor device.
  24. Okada, Kazuo; Kitagawa, Katsuhiko; Noma, Takashi; Otsuka, Shigeki; Yamada, Hiroshi; Ishibe, Shinzo; Morita, Yuichi; Okubo, Noboru; Shinogi, Hiroyuki; Okigawa, Mitsuru, Semiconductor device.
  25. Noma, Takashi; Okada, Kazuo; Ishibe, Shinzo; Kitagawa, Katsuhiko; Morita, Yuichi; Otsuka, Shigeki; Yamada, Hiroshi; Okubo, Noboru; Shinogi, Hiroyuki; Okigawa, Mitsuru, Semiconductor device and manufacturing method of the same.
  26. Glenn,Thomas P.; Webster,Steven, Snap lid camera module.
  27. Hsin, Chung Hsien, Stacked structure for an image sensor.
  28. Hsieh, Jackson; Wu, Jichen; Chen, Bruce, Stacked structure of an image sensor.
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