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Flexible circuit with electrostatic damage limiting feature and method of manufacture 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/03
출원번호 US-0823220 (2001-03-29)
발명자 / 주소
  • Robert S. Dodsworth
출원인 / 주소
  • 3M Innovative Properties Company
대리인 / 주소
    Darla P. Fonseca
인용정보 피인용 횟수 : 20  인용 특허 : 25

초록

A flexible circuit incorporating electrostatic discharge (ESD) limiting features and being suitable for use in the fabrication of hard disk drives for computer applications. Conductive polymer strips are implemented to enhance the static dissipative characteristics of the flexible circuit and to pro

대표청구항

1. A flexible circuit, comprising:a dielectric substrate; a conductive layer on a surface of the dielectric substrate, the conductive layer patterned to define a plurality of spaced apart conductive elements; and a conductive polymer strip in contact with and extending between at least two of the co

이 특허에 인용된 특허 (25)

  1. Kimock Fred M. (Macungie PA) Knapp Bradley J. (Allentown PA) Finke Steven J. (Kutztown PA) Galdieri John V. (New Tripoli PA), Abrasion wear resistant coated substrate product.
  2. Martin Lawrence L. ; O'Neill David G. ; David Moses M., Abrasive article having a diamond-like coating layer and method for making same.
  3. Selifanov Oleg Vladimirovich (Apt. 52 ; Bldg. 6 Sosny Minsk BYX 220109 ) Tochitsky Eduard Ivanovich (Apt. 188 ; Bldg. 15 Kulman Str. Minsk BYX 220100 ) Akulich Valerii Vladimirovich (Apt. 40 ; Block , Abrasive material for precision surface treatment and a method for the manufacturing thereof.
  4. Giglia Robert D. (Rye NY) Clasen Richard H. (West Redding CT), Articles coated with adherent diamondlike carbon films.
  5. Banholzer William F. (Scotia NY) Johnson Roger N. (Hagaman NY) Leonard Gary L. (Schenectady NY) Mehan Richard L. (Scotia NY) Spiro Clifford L. (Niskayuna NY), CVD diamond coating annulus components and method of their fabrication.
  6. Litington, Alan H., Carbon coated infra red reflectors.
  7. Green Geoffrey W. (Malvern GB2) Lettington Alan H. (Worcester GB2), Coating insulating materials by glow discharge.
  8. Tomaswick Kathleen M. (Kittanning PA) LaCamera Alfred F. (Penn Township ; Allegheny County PA), Container body having improved gas barrier properties.
  9. Cohen Stephen A. (Wappingers Falls NY) Edelstein Daniel C. (New Rochelle NY) Grill Alfred (White Plains NY) Paraszczak Jurij R. (Pleasantville NY) Patel Vishnubhai V. (Yorktown NY), Diamond-like carbon for use in VLSI and ULSI interconnect systems.
  10. Gerber Joel A. (Saint Paul MN) Gits Peter A. (White Bear Lake MN), Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board.
  11. Gazdik Charles E. (Endicott NY) McBride Donald G. (Binghamton NY), Electronic package assembly method.
  12. Anschel Morris (Binghamton NY) Sammakia Bahgat G. (Johnson City NY), Electronic package with heat spreader member.
  13. Arya Satya P. ; Hughbanks Timothy Scott ; Voldman Steven Howard ; Wallash Albert John, Electrostatic discharge protection system for MR heads.
  14. Himes Adam K. ; Schulz Kevin J. ; Sluzewski David A. ; Qualey David G., Flex circuit head interconnect with insulating spacer.
  15. Yang Rui, Flexible circuits with static discharge protection and process for manufacture.
  16. Yoshioka Toshio,JPX ; Yamauchi Akihito,JPX, Flexible metal-clad dielectrics, having beryllium copper foil.
  17. Hughbanks Timothy Scott ; Robertson Neil Leslie ; Voldman Steven Howard ; Wallash Albert John, Having parastic shield for electrostatic discharge protection.
  18. Carlson Carl J. ; Doundakov Viktor S., Head gimbal assembly with low stiffness flex circuit and ESD Protection.
  19. Inaba Masaichi,JPX, Manufacturing method for magnetic head junction board.
  20. Klun Thomas P. (Lakeland MN) Truong Thach G. (Austin TX), Method for making flexible circuits.
  21. Gazdik Charles E. (Endicott NY) McBride Donald G. (Binghamton NY), Multi-layer flexible film module.
  22. Hempel Hans-Ulrich (Overath DEX) Grnert Margarete (Kaarst DEX) Tesmann Holger (Dsseldorf DEX) Mller Heinz (Monheim DEX), Organopolysiloxane anti-foaming agents.
  23. Mackowski Jean M. (Villeurbanne FRX), Process for depositing a thin layer of a material on the wall of a hollow body.
  24. Bajorek Christopher H. (Los Gatos CA) Erpelding A. David (San Jose CA) Garfunkel Glen A. (Los Gatos CA) Pattanaik Surya (San Jose CA) Robertson Neil L. (Campbell CA) Wallash Albert J. (Morgan Hill CA, Shorted magnetoresistive head leads for electrical overstress and electrostatic discharge protection during manufacture.
  25. Eggler James F. (Stonington CT) Johnson Michael R. (Gales Ferry CT) Melvin ; Jr. Lawrence S. (Ledyard CT), Substituted hexahydrobenzo[e]indene and octahydrophenanthrene CNS agents and pharmaceutical compositions thereof.

이 특허를 인용한 특허 (20)

  1. Bandy, IV,William Thomas; Iben,Icko Eric Timothy; Golcher,Peter John; Kriehn,John Bradley; Lam,Ho Yiu; Snyder,Jeffrey Serrell; Tretter,Larry LeeRoy; Zamora,George G., ESD dissipative coating on cables.
  2. Coon,Warren, ESD protected suspension interconnect.
  3. Subrahmanyam, Jai N.; Palmer, Darrell D.; Chue, Jack M., ESD-protected head gimbal assembly for use in a disk drive.
  4. Huha, Marsha; Schulz, Kevin; Weidemann, Werner, Flex on suspension with dissipative polymer substrate acting as bleed resistor for minimizing ESD damage.
  5. Shin,Sang chul, Hard disk drive comprising flexible printed circuit with damping material.
  6. Arai, Hajime; Someya, Ikuo; Kawatake, Ryuichi; Higashi, Tsukasa, Head suspension having wiring disposed in contact with slightly conductive flexible resin.
  7. Arai, Hajime; Someya, Ikuo, Head suspension having wiring disposed with conductive layer.
  8. Thaveeprungsriporn,Visit; Hu,Szu Han, Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material.
  9. Pyles, Robert A.; Hedden, Ronald C., Process for incorporating an ion-conducting polymer into a polymeric article to achieve anti-static behavior.
  10. Pyles, Robert A.; Hedden, Ronald C., Process for incorporating an ion-conducting polymer into a polymeric article to achieve anti-static behavior.
  11. Nakayabu, Hiroshige, Substrate, connecting structure and electronic equipment.
  12. Nakayabu,Hiroshige, Substrate, connecting structure and electronic equipment.
  13. Ishii,Jun; Ooyabu,Yasunari, Suspension board with circuit.
  14. Toukairin, Kouichi; Suzuki, Hirofumi; Kajitani, Osamu; Saito, Noriyuki; Kashima, Hideki; Higashi, Tsukasa, Suspension device.
  15. Ishii, Jun; Funada, Yasuhito; Ooyabu, Yasunari, Wired circuit board.
  16. Ooyabu, Yasunari; Ishii, Jun; Terada, Naohiro, Wired circuit board.
  17. Ooyabu,Yasunari; Ishii,Jun, Wired circuit board.
  18. Ooyabu,Yasunari; Oda,Takashi; Oda,Shinichi, Wired circuit board.
  19. Ishii, Jun; Funada, Yasuhito; Ooyabu, Yasunari, Wired circuit board and production method thereof.
  20. Wakaki,Shuichi; Ohkawa,Tadao; Ohwaki,Yasuhito, Wired circuit board for controlling characteristic impedances of a connection terminal.
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