초록 ▼

A heat generating component such as a microprocessor, in a small form factor, low profile electronic device such as a laptop computer is cooled by using an elongated hollow heat exchanger with a fan at one end of the heat exchanger. A heat pipe, having two ends, has one end thermally coupled to the

A heat generating component such as a microprocessor, in a small form factor, low profile electronic device such as a laptop computer is cooled by using an elongated hollow heat exchanger with a fan at one end of the heat exchanger. A heat pipe, having two ends, has one end thermally coupled to the heat exchanger and the other end thermally coupled to the heat generating component. A heat sink thermally coupled to the other end of the heat pipe, in thermal contact with the heat producing component may be used. In a laptop computer having a four vertically extending side walls including a front wall a back wall and two side walls where the heat generating component is a microprocessor, the heat exchanger can extends in a direction adjacent and parallel to one of the side walls, with an air outlet formed in one of said front and rear walls and an air inlet in the other of said front or rear walls or the side wall to which the heat exchanger is adjacent.

대표청구항 ▼

1. Apparatus for cooling a semiconductor comprising:a. a heat sink placed in thermal contact with the semiconductor; b. an elongated hollow heat exchanger comprising: i. a duct, having a length, with an outer surface and an inner surface; and ii. members attached to the inner surface of said duct in

1. Apparatus for cooling a semiconductor comprising:a. a heat sink placed in thermal contact with the semiconductor; b. an elongated hollow heat exchanger comprising: i. a duct, having a length, with an outer surface and an inner surface; and ii. members attached to the inner surface of said duct increasing its internal surface area; c. a fan at one end of said duct; and d. a heat pipe having an evaporator portion at one end and a condenser portion at the other end, the one end thermally coupled to said heat sink and the other end in direct thermal contact with the outer surface of the duct, extending longitudinally over substantially all of the length of said duct.