초록 ▼

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a sem

Chip-scale semiconductor packages of the fan-out type and methods of manufacturing such packages are disclosed. In one package embodiment within the invention, the package substrate is stiff enough to effectively carry an increased number of solder balls on an exterior area outside the edge of a semiconductor chip, in addition to the area above the chip. In another package embodiment, a molded support is mounted to the lower surface of the exterior area. The methods of the present invention include making a plurality of packages on a substrate. Prior to sawing a wafer to obtain chips for the assembly method, the wafer is inspected so as to discriminate between good chips and the defective chips. Only good chips are mounted to a wafer-shaped or strip-shaped substrate.

대표청구항 ▼

1. A semiconductor package comprising:a semiconductor chip having a first surface and a plurality of conductive pads on the first surface; a substrate having a first surface and an opposite second surface having a plurality of conductive metallizations thereon, wherein the chip is mounted on the fir

1. A semiconductor package comprising:a semiconductor chip having a first surface and a plurality of conductive pads on the first surface; a substrate having a first surface and an opposite second surface having a plurality of conductive metallizations thereon, wherein the chip is mounted on the first surface of the substrate, an exterior portion of the substrate extends outside an edge of the first surface of said chip, and said substrate has an opening juxtaposed with the pads; a plurality of conductors, wherein each conductor is between a pad of the chip and a metallization and extends through the opening; a hardened first packaging material in said opening, said first packaging material covering the pads and conductors; a support for said exterior portion of the substrate; and a plurality of solder balls, wherein each solder ball is on a metallization of the second surface of the substrate, and a plurality of said solder balls are arranged on the exterior portion of the second surface of the substrate.