초록 ▼

A cooling apparatus using "low profile extrusions" is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling

A cooling apparatus using "low profile extrusions" is disclosed. The cooling apparatus of the present invention may be incorporated into a closed loop liquid cooling system which is particularly well suited to heat removal from electronic components in applications where space is limited. A cooling system in accordance with the present invention is illustrated for use in a typical wireless telecommunication base station for removing heat from power amplifiers and other electronic components. Cooling is carried out by drawing heat away from the electronic components and into at least one low profile extrusion attached directly to the heat generating components or a heat sink, and transferring the removed heat to a cooling fluid circulating through a plurality of micro tubes or channels within each low profile extrusion. The cooling fluid is subsequently pumped through a liquid-to-air heat exchanger, to reject the removed heat into the atmosphere, prior to being recirculated through each of the low profile extrusions.

대표청구항 ▼

1. An electronic enclosure cooling system comprising:a housing; at least one low profile extrusion of unitary construction adapted for receiving heat from heat generating components installed within the housing, said at least one unitary low profile extrusion being formed with a unitary array of mic

1. An electronic enclosure cooling system comprising:a housing; at least one low profile extrusion of unitary construction adapted for receiving heat from heat generating components installed within the housing, said at least one unitary low profile extrusion being formed with a unitary array of micro tubes, said unitary array including a plurality of microtubes disposed in generally parallel, extruded relationship; at least one quick connect coupling in communication with said unitary array of microtubes; a closed fluid loop formed when said at least one unitary low profile extrusion is secured to said housing via said at least one quick connect coupling, said closed fluid loop comprised at least in part by said unitary array of microtubes, said closed fluid loop for containing a heat transfer fluid for removing heat from said heat generating components; a heat exchanger for removing heat from a heat transfer fluid; and means for circulating the heat transfer fluid from said heat exchanger, through said unitary array of microtubes, and back to said heat exchanger in said closed fluid loop.