초록 ▼

A silicone-containing resin, film and film on a subweb are described. The resin and film are formed from (i) polyolefin, (ii) dimethyl polysiloxane having functional end-groups, (iii) vinyl silane compound, and (iv) ultra-high molecular weight silicone polymer optionally using (v) an organo-peroxide

A silicone-containing resin, film and film on a subweb are described. The resin and film are formed from (i) polyolefin, (ii) dimethyl polysiloxane having functional end-groups, (iii) vinyl silane compound, and (iv) ultra-high molecular weight silicone polymer optionally using (v) an organo-peroxide agent and (vi) an organo-metallic moisture curing agent. Resins consisting essentially of (a) functionalized polyolefins; (b) dimethyl polysiloxanes having functional end-groups to react with said functionalized polyolefins; (c) ultra-high molecular weight silicone and optional organo-metallic moisture curing agent and films or multilayer structures made therefrom are also described. The film is suitable for use in release films and in liquid-absorbing products.

대표청구항 ▼

1. A silicone-containing resin comprising:a) a polyolefin selected from (i) an unfunctionalized polyolefin homopolymer or copolymer of unsaturated hydrocarbons having 2-20 carbon atoms or mixtures thereof or from (ii) a functionalized polyolefin selected from a direct copolymer of ethylene and a pol

1. A silicone-containing resin comprising:a) a polyolefin selected from (i) an unfunctionalized polyolefin homopolymer or copolymer of unsaturated hydrocarbons having 2-20 carbon atoms or mixtures thereof or from (ii) a functionalized polyolefin selected from a direct copolymer of ethylene and a polar monomer or from (iii) an ionomeric copolymer or blends thereof or from (iv) a graft copolymer or blends of graft copolymers or mixture of (i), (ii), (iii) or (iv), b) a dimethyl polysiloxane having functional end-groups, c) a vinyl silane compound, and d) an ultra-high molecular weight silicone polymer having a number average molecular weight range from about 350,000 to 1 million wherein components b) and d) are different from each other.