초록 ▼

Bonding pads for integrated circuits include first and second spaced apart conductive layers, a third continuous conductive layer between the first and second spaced apart conductive layers and an array of spaced apart insulating islands in the third continuous conductive layer that extend therethro

Bonding pads for integrated circuits include first and second spaced apart conductive layers, a third continuous conductive layer between the first and second spaced apart conductive layers and an array of spaced apart insulating islands in the third continuous conductive layer that extend therethrough such that sidewalls of the insulating islands are surrounded by the third continuous conductive layer. A fourth continuous conductive layer also may be provided between the third continuous conductive layer and the second conductive layer and a second array of spaced apart insulating islands may be provided in the fourth continuous conductive layer, that extend therethrough, such that sidewalls of the insulating islands are surrounded by the fourth continuous conductive layer. A fifth continuous conductive layer also may be provided between the third and fourth continuous conductive layers and a third array of spaced apart insulating islands may be provided in the fifth continuous conductive layer, that extend therethrough, such that sidewalls of the third array of insulating islands are surrounded by the fifth continuous conductive layer. The first and second arrays of spaced apart insulating islands preferably laterally overlap each other and may be congruent to each other. The third array of spaced apart insulating islands also may laterally overlap the first and second arrays. Preferably, the third array of spaced apart insulating islands are of the same shape as the first array, but of different sizes.

대표청구항 ▼

1. A method of fabricating an internal structure of a bonding pad for an integrated circuit comprising the steps of:forming an underlying conductive layer on an integrated circuit substrate; forming a continuous conductive layer on the underlying conductive layer and electrically connected thereto,

1. A method of fabricating an internal structure of a bonding pad for an integrated circuit comprising the steps of:forming an underlying conductive layer on an integrated circuit substrate; forming a continuous conductive layer on the underlying conductive layer and electrically connected thereto, the continuous conductive layer including therein an array of spaced apart insulating islands that extend therethrough such that sidewalls of the insulating islands are surrounded by the continuous conductive layer; and forming an overlying conductive layer on the continuous conductive layer and electrically connected thereto.