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Method of surface preparation 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0482222 (2000-01-13)
발명자 / 주소
  • Jeffery W. Butterbaugh
  • Brent Schwab
출원인 / 주소
  • FSI International, Inc.
대리인 / 주소
    Vidas, Arrett & Steinkraus, P.A.
인용정보 피인용 횟수 : 9  인용 특허 : 59

초록

A semiconductor substrate is heated via exposure to ultraviolet radiation substantially in the absence of a halogen containing chemical and subsequently exposed to a halogen-containing gas in the absence of ultraviolet radiation to remove contaminants therefrom.

대표청구항

1. A method of treating a semiconductor substrate comprising the steps of:providing a semiconductor substrate having oxides on the surface thereof in a process chamber; applying ultraviolet radiation to the substrate substantially in the absence of a halogen containing chemical to heat the substrate

이 특허에 인용된 특허 (59)

  1. Mizosaki Kengo,JPX ; Yoshida Masaaki,JPX, Apparatus and method for cleaning substrate surface by use of Ozone.
  2. Moslehi Mehrdad M. (Dallas TX) Paranjpe Ajit P. (Dallas TX) Davis Cecil J. (Greenville TX), Apparatus and method for in-situ deep ultraviolet photon-assisted semiconductor wafer processing.
  3. Liu Yung S. (Schenectady NY) Grubb Willard T. (Schenectady NY), Apparatus and method for photoetching of polyimides, polycarbonates and polyetherimides.
  4. Panico C. Richard (Medford MA), Apparatus for rapid curing of resinous materials and method.
  5. Hayashi Noriyuki (Shiga JPX) Murayama Hiromi (Kyoto JPX) Ishino Yukihiko (Kyoto JPX), Apparatus for removing organic substance from substrate.
  6. Hiatt C. Fred (Burnsville MN) Gray David C. (Sunnyvale CA) Butterbaugh Jeffery W. (Chanhassen MN), Apparatus for surface conditioning.
  7. Norman John A. T. (Whitehall PA) Ivankovits John C. (Northampton PA) Roberts David A. (Carlsbad CA) Bohling David A. (Emmaus PA), Cleaning agents comprising beta-diketone and beta-ketoimine ligands and a process for using the same.
  8. Bohling David A. (Emmaus PA) Ivankovits John C. (Allentown PA) Roberts David A. (Carlsbad CA), Cleaning agents for fabricating integrated circuits and a process for using the same.
  9. Grant Robert W. (Excelsior MN) Novak Richard E. (Plymouth MN), Cluster tool dry cleaning system.
  10. Grant Robert W. (Allenstown PA) Ruzyllo Jerzy (State College PA) Torek Kevin (State College PA), Controlled etching of oxides via gas phase reactions.
  11. Bhat Suresh A. (Fremont CA), Controlled, gas phase process for removal of trace metal contamination and for removal of a semiconductor layer.
  12. Fayfield Robert T. ; Heitxinger John M., Direct vapor delivery of enabling chemical for enhanced HF etch process performance.
  13. Sugino Rinji (Kawasaki JPX) Okuno Masaki (Kawasaki JPX) Sato Yasuhisa (Kawasaki JPX), Dry cleaning process for cleaning a surface.
  14. Sugino Rinji,JPX ; Okuno Masaki,JPX ; Sato Yasuhisa,JPX, Dry cleaning process for cleaning a surface.
  15. Tsujii Kanji (Nishitama JPX) Yajima Yusuke (Musashino JPX) Murayama Seiichi (Kokubunji JPX), Dry etching apparatus.
  16. Terakado Shingo (Tsukuba JPX), Dry etching method.
  17. Roberts David A. (Carlsbad CA) Ivankovits John C. (Northampton PA) Norman John A. T. (Whitehall PA) Bohling David A. (Emmaus PA), Etching agents comprising bb 상세보기
  • Haigh John (Ipswich GB2) Aylett Martin R. (Felixstowe GB2), Etching method.
  • Yamazaki Shunpei (Tokyo JPX), Etching method for the manufacture of a semiconductor integrated circuit.
  • George Mark A. (Allentown PA) Bohling David A. (Emmaus PA), Gas phase cleaning agents for removing metal containing contaminants from integrated circuit assemblies and a process fo.
  • Blackwood Robert S. (Lubbock TX) Biggerstaff Rex L. (Lubbock TX) Clements L. Davis (Lincoln NE) Cleavelin C. Rinn (Lubbock TX), Gaseous process and apparatus for removing films from substrates.
  • Ivankovits John C. (Allentown PA) Bohling David A. (Emmaus PA) Roberts David A. (Carlsbad CA), Halogenated carboxylic acid cleaning agents for fabricating integrated circuits and a process for using the same.
  • Okuhira Hidekazu (Kokubunji JPX) Wada Yasuo (Bunkyo JPX), Manufacturing apparatus for semiconductor devices.
  • Bersin Richard L. (Orange CT), Method and apparatus for dry processing of substrates.
  • Bersin Richard L. (Orange CT), Method and apparatus for dry processing of substrates.
  • Bender Jim, Method and apparatus for removal of material utilizing near-blackbody radiator means.
  • Butterbaugh Jeffery W. ; Gray David C. ; Fayfield Robert T. ; Siefering Kevin ; Heitzinger John ; Hiatt Fred C., Method and apparatus for surface conditioning.
  • Fukuda Hisashi (Tokyo JPX), Method and device for cleaning substrates.
  • Dettling Allen ; Martin Alan ; Aronow Kurt, Method for ambient light subtraction in a photoplethysmographic measurement instrument.
  • Peckman Robert, Method for cleaning semiconductor wafers with an external heat source.
  • Itoh Hiromi (Hyogo JPX) Iwasaki Masanobu (Hyogo JPX) Tokui Akira (Hyogo JPX) Tsukamoto Katsuhiro (Hyogo JPX), Method for pretreating semiconductor substrate by photochemically removing native oxide.
  • Izumi Akira (Kyoto JPX) Toei Keiji (Kyoto JPX) Watanabe Nobuatsu (Kyoto JPX) Chong Yong-Bo (Kyoto JPX), Method for removing a film on a silicon layer surface.
  • Vig John R. (Colts Neck NJ) LeBus John W. (Farmingdale NJ), Method of cleaning surfaces by irradiation with ultraviolet light.
  • Tsujii Kanji (Nishitama JPX) Yajima Yusuke (Musashino JPX) Murayama Seiichi (Kokubunji JPX), Method of dry etching.
  • Nishizawa, Jun-ichi, Method of fabricating semiconductor device by dry process utilizing photochemical reaction, and apparatus therefor.
  • Kawai Kenji (Hyogo JPX), Method of forming interconnection patterns.
  • Murayama Seiichi (Kokubunji JPX) Tsujii Kanji (Tokyo JPX) Yajima Yusuke (Musashino JPX), Method of photochemical surface treatment.
  • Izumi Akira (Kyoto JPX) Matsuka Takeshi (Kyoto JPX), Method of removing native oxide film from a contact hole on silicon wafer.
  • McMillan Larry D. (Colorado Springs CO) Paz de Araujo Carlos A. (Colorado Springs CO), Methods and apparatus for material deposition.
  • Morishige Yukio (Tokyo JPX), Optical CVD method with a strong optical intensity used during an initial period and device therefor.
  • McNeilly Michael A. ; deLarios John M. ; Nobinger Glenn L. ; Krusell Wilbur C. ; Kao Dah-Bin ; Manriquez Ralph K. ; Fan Chiko, Organic preclean for improving vapor phase wafer etch uniformity.
  • Watanabe Nobuatsu (136 Uguisudail Nagaokakyo-shi ; Kyoto JPX) Chong Yong-Bo (Kyoto JPX) Tatsuno Toshio (Osaka JPX) Okada Tomoyoshi (Osaka JPX) Izumi Akira (Kyoto JPX) Toei Keiji (Kyoto JPX), Oxide film removing apparatus and removing method thereof using azeotropic vapor mixture.
  • Blum Samuel E. (White Plains NY) Holloway Karen L. (Bronx NY) Srinivasan Rangaswamy (Ossining NY), Patterning of polyimide films with far ultraviolet light.
  • Yamazaki Shunpei (Tokyo JPX) Imatoh Shinji (Kanagawa JPX) Hayashi Shigenori (Kanagawa JPX), Photochemical vapor phase reaction apparatus and method of causing a photochemical vapor phase reaction.
  • Elliott David J. ; Hollman Richard F., Photoreactive surface cleaning.
  • Panico C. Richard (21 Leighton St. Medford MA 02155), Photoresist curing method.
  • Sugino Rinshi (Odawara JPX), Process and apparatus for dry cleaning by photo-excited radicals.
  • Kinoshita Keizo (Tokyo JPX), Process and apparatus for etching iron-containing materials.
  • Sugino Rinshi (Atsugi JPX) Ito Takashi (Kawasaki JPX), Process for cleaning surface of semiconductor substrate.
  • Green Martin Laurence ; Ma Yi, Process for semiconductor device fabrication.
  • Holmer Arthur Edward ; Litwin Michael Mark ; Albaugh Kevin Bruce, Removal of carbon from substrate surfaces.
  • Ohmori Toshiaki (Itami JPX) Fukumoto Takaaki (Itami JPX), Semiconductor manufacturing apparatus.
  • Oda Masao (Amagasaki JPX) Kobayashi Toshiyuki (Amagasaki JPX) Kinoshita Yoshimi (Amagasaki JPX), Semiconductor producing apparatus.
  • Khan Ashraf R. ; Ramanathan Sasangan ; Foggiato Giovanni Antonio, Surface modification of semiconductors using electromagnetic radiation.
  • Kubodera Masao (Yamanashi JPX) Narushima Masaki (Yamanashi JPX) Ozawa Masahito (Yamanashi JPX) Kumagai Hiromi (Tokyo JPX) Yonenaga Tomihiro (Yamanashi JPX) Tanaka Sumi (Yamanashi JPX), Surface processing apparatus.
  • Ninomiya Ken (Nakano JPX) Suzuki Keizo (Hachioji JPX) Nishimatsu Shigeru (Kokubunji JPX), Surface treatment apparatus.
  • Lawing Andrew Scott ; Fayfield Robert T. ; Sawin Herbert H. ; Chang Jane, UV/halogen metals removal process.
  • Fayfield Robert T. ; Schwab Brent D., UV/halogen treatment for dry oxide etching.
  • Tanaka Masato (Hikone JPX) Nishizawa Hisao (Hikone JPX) Hirai Nobuyuki (Hikone JPX) Shinbara Kaoru (Hikone JPX) Yoshioka Hitoshi (Hikone JPX), Wafer cleaning method and apparatus therefore.
  • 이 특허를 인용한 특허 (9)

    1. Gao, David; Mieno, Fumitake, Application of millisecond heating source for surface treatment.
    2. Elliott, David J.; Millman, Jr., Ronald P.; Tardif, Murray; Aiello, Krista, Method for surface cleaning.
    3. Gao, David; Mieno, Fumitake, Method of rapid thermal treatment using high energy electromagnetic radiation of a semiconductor substrate for formation of epitaxial materials.
    4. Vane, Ronald A., Oxidative cleaning method and apparatus for electron microscopes using UV excitation in an oxygen radical source.
    5. Wang, Yen-Kun Victor; Chou, Shang-I; Augustino, Jason, Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substrates.
    6. Wang, Yen-Kun Victor; Chou, Shang-I; Autustino, Jason, Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substrates.
    7. Augustino, Jason; Hart, Tim, Quartz window for a degas chamber.
    8. Kawamura, Shigeru; Hayashi, Teruyuki, Substrate processing method and substrate processing apparatus.
    9. Hart, William T.; Egley, Fred Dennis, UV lamp assembly of degas chamber having rotary shutters.
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