초록 ▼

Presented is an end-effector for grasping integrated circuit wafers with a talon-like device that effectively grips an arcuate peripheral "free zone" of the wafer-without effecting contact of the wafer in a manner to contaminate it. Structurally, in one aspect of the invention, the end-effector or t

Presented is an end-effector for grasping integrated circuit wafers with a talon-like device that effectively grips an arcuate peripheral "free zone" of the wafer-without effecting contact of the wafer in a manner to contaminate it. Structurally, in one aspect of the invention, the end-effector or talon-like device is formed by-confronting top and bottom plate members configured to form a "shell" within which is displaceably mounted a member which, when selectively displaced in one direction by the imposition-of-an-appropriate force, opens a normally-closed gripping member for receiving the arcuate peripheral "free zone" of the wafer and when selectively displaced in the opposite direction by the removal of the opening force tightly grips the arcuate peripheral "free zone" of the wafer to releasably retain it attached to the end-effector, from which it may selectively be released by the imposition of force in an opening direction that opposes and overcomes the force that effects gripping of the wafer. An indicator may be provided to signal the proper positioning of the wafer in relation to the end-effector, and a control system may be provided to effect opening and closing operation of the arcuate talon-like clamp.

대표청구항 ▼

1. Handling apparatus for gripping an integrated circuit wafer symmetrical about a central axis that includes opposed top and bottom surfaces, at least one of which includes a circular surface area constituting a non-intrusion area and having an outer perimeter spaced radially inwardly from the oute

1. Handling apparatus for gripping an integrated circuit wafer symmetrical about a central axis that includes opposed top and bottom surfaces, at least one of which includes a circular surface area constituting a non-intrusion area and having an outer perimeter spaced radially inwardly from the outer periphery of the integrated circuit wafer and on which circular non-intrusion area are embedded individual integrated circuits, the annular surface defined between the perimeter of said circular non-intrusion area and the periphery of said wafer constituting a free-zone by which said wafer may be grasped, comprising:a) confronting top and bottom plates non-adjustably spaced to define a hollow shell having an opening of fixed dimension constituting a slot therein for receiving a peripheral edge portion of said integrated circuit wafer that projects into said shell through said opening; and b) means within said hollow shell selectively actuable to effect gripping impingement of said annular free-zone surface area of said wafer defined between the perimeter of said circular non-intrusion area and the peripheral edge of said wafer that projects into said hollow shell through said opening, said gripping impingement being effected in a direction perpendicular to the top and bottom surfaces of said wafer.