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Methods of forming thin films by atomic layer deposition 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/31
출원번호 US-0871430 (2001-05-31)
우선권정보 KR-0073807 (2000-12-06)
발명자 / 주소
  • Seung-hwan Lee KR
  • Yeong-kwan Kim KR
  • Dong-chan Kim KR
  • Young-wook Park KR
출원인 / 주소
  • Samsung Electronics Co., Ltd. KR
대리인 / 주소
    Myers Bigel Sibley & Sajovec
인용정보 피인용 횟수 : 330  인용 특허 : 13

초록

Methods of forming thin films include forming a first layer comprising a first element that is chemisorbed to a surface of a substrate, by exposing the surface to a first source gas having molecules therein that comprise the first element and a halogen. A step is then performed to expose the first l

대표청구항

1. A method for forming a thin film comprising:providing a first reactant containing a halogen on a semiconductor substrate in order to chemisorb a first reactant adsorption layer combined with the halogen on the semiconductor substrate; providing activated hydrogen gas to the first reactant adsorpt

이 특허에 인용된 특허 (13)

  1. Doan Trung T. ; Sandhu Gurtej Singh ; Prall Kirk ; Sharan Sujit, Apparatus having titanium silicide and titanium formed by chemical vapor deposition.
  2. Ono Masato (Minami Ashigara JPX) Higashi Taketoshi (Minami Ashigara JPX) Watanabe Masao (Minami Ashigara JPX) Yokoi Masaki (Minami Ashigara JPX) Fukuda Yuzuru (Minami Ashigara JPX) Yagi Shigeru (Mina, Electrophotographic photoreceptor having a photoconductive layer of amorphous silicon and surface layer.
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  5. Shindo Masanari (Hachioji JPX) Sato Shigeru (Hino JPX) Kaneko Akinari (Hachioji JPX), Method for forming a compound semiconductor film.
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  7. Nakamura Kazuyo (Tenri JPX) Uda Keiichiro (Nara JPX) Yamazaki Osamu (Nara JPX) Hattori Hiromi (Nara JPX) Fukushima Nobutaka (Tenri JPX) Onishi Shigeo (Nara JPX), Method for manufacturing a semiconductor device comprising titanium.
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  146. Winkler, Jereld Lee, Method and systems for in-situ formation of intermediate reactive species.
  147. Hausmann, Dennis; Henri, Jon; van Schravendijk, Bart; Srinivasan, Easwar, Method for depositing a chlorine-free conformal SiN film.
  148. Hausmann, Dennis; Henri, Jon; van Schravendijk, Bart; Srinivasan, Easwar, Method for depositing a chlorine-free conformal sin film.
  149. Hausmann, Dennis; Henri, Jon; van Schravendijk, Bart; Srinivasan, Easwar, Method for depositing a chlorine-free conformal sin film.
  150. Suemori, Hidemi, Method for depositing dielectric film in trenches by PEALD.
  151. Fang, Hongbin; Yoon, Hyung-Suk A.; Lai, Ken Kaung; Young, Chi Chung; Horng, James; XI, Ming; Yang, Michael X.; Chung, Hua, Method for depositing refractory metal layers employing sequential deposition techniques.
  152. Kang, DongSeok, Method for depositing thin film.
  153. Xi, Ming; Sinha, Ashok; Kori, Moris; Mak, Alfred W.; Lu, Xinliang; Lai, Ken Kaung; Littau, Karl A., Method for depositing tungsten-containing layers by vapor deposition techniques.
  154. Xi,Ming; Sinha,Ashok; Kori,Moris; Mak,Alfred W.; Lu,Xinliang; Lai,Ken Kaung; Littau,Karl A., Method for depositing tungsten-containing layers by vapor deposition techniques.
  155. Xi,Ming; Sinha,Ashok; Kori,Moris; Mak,Alfred W.; Lu,Xinliang; Lai,Ken Kaung; Littau,Karl A., Method for depositing tungsten-containing layers by vapor deposition techniques.
  156. Takamure, Noboru; Okabe, Tatsuhiro, Method for forming Ti-containing film by PEALD using TDMAT or TDEAT.
  157. Chou, Anthony I.; Chudzik, Michael P.; Furukawa, Toshiharu; Gluschenkov, Oleg; Kirsch, Paul D.; Scheer, Kristen C.; Shepard, Jr., Joseph, Method for forming a uniform distribution of nitrogen in silicon oxynitride gate dielectric.
  158. Shiba, Eiichiro, Method for forming aluminum nitride-based film by PEALD.
  159. Fukazawa, Atsuki, Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition.
  160. Fukazawa, Atsuki; Fukuda, Hideaki; Takamure, Noboru; Zaitsu, Masaru, Method for forming dielectric film in trenches by PEALD using H-containing gas.
  161. Kimura, Yosuke; de Roest, David, Method for forming film having low resistance and shallow junction depth.
  162. Ishikawa, Dai; Fukazawa, Atsuki, Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches.
  163. Namba, Kunitoshi, Method for forming silicon oxide cap layer for solid state diffusion process.
  164. Ranish, Joseph M.; Singh, Kaushal K., Method for forming silicon-containing materials during a photoexcitation deposition process.
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  171. Metzner, Craig; Kher, Shreyas; Kim, Yeong Kwan; Rocklein, M. Noel; George, Steven M., Method for hafnium nitride deposition.
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  173. Yamagishi, Takayuki; Suwada, Masaei; Tanaka, Hiroyuki, Method for positioning wafers in multiple wafer transport.
  174. Kato, Richika; Nakano, Ryu, Method for protecting layer by forming hydrocarbon-based extremely thin film.
  175. Kato, Richika; Okuro, Seiji; Namba, Kunitoshi; Nonaka, Yuya; Nakano, Akinori, Method for protecting layer by forming hydrocarbon-based extremely thin film.
  176. Ganguli, Seshadri; Chen, Ling; Ku, Vincent W., Method for providing gas to a processing chamber.
  177. Ma, Paul; Aubuchon, Joseph F.; Lu, Jiang; Chang, Mei, Method for tuning a deposition rate during an atomic layer deposition process.
  178. Doan,Trung Tri; Breiner,Lyle D.; Ping,Er Xuan; Zheng,Lingyi A., Method of atomic layer deposition on plural semiconductor substrates simultaneously.
  179. Zaitsu, Masaru, Method of atomic layer etching using functional group-containing fluorocarbon.
  180. Zaitsu, Masaru; Kobayashi, Nobuyoshi; Kobayashi, Akiko; Hori, Masaru; Kondo, Hiroki; Tsutsumi, Takayoshi, Method of cyclic dry etching using etchant film.
  181. Verplancken, Donald J.; Sinha, Ashok K., Method of delivering activated species for rapid cyclical deposition.
  182. Zope, Bhushan N.; Gelatos, Avgerinos V.; Zheng, Bo; Lei, Yu; Fu, Xinyu; Gandikota, Srinivas; Yu, Sang Ho; Abraham, Mathew, Method of enabling seamless cobalt gap-fill.
  183. Zope, Bhushan N.; Gelatos, Avgerinos V.; Zheng, Bo; Lei, Yu; Fu, Xinyu; Gandikota, Srinivas; Yu, Sang-Ho; Abraham, Mathew, Method of enabling seamless cobalt gap-fill.
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  187. Beulens,Jacobus Johannes; Wan,Yuet Mei, Method of fabricating silicon nitride nanodots.
  188. Chung, Hua; Chen, Ling; Ku, Vincent W., Method of film deposition using activated precursor gases.
  189. Knaepen, Werner; Maes, Jan Willem; Jongbloed, Bert; Kachel, Krzysztof Kamil; Pierreux, Dieter; De Roest, David Kurt, Method of forming a structure on a substrate.
  190. Lim, Jung Wook; Yun, Sun Jin; Lee, Jin Ho, Method of forming a thin film in a semiconductor device.
  191. Ramaswamy, Nirmal; Sandhu, Gurtej; Srinivasan, Bhaskar; Smythe, John, Method of forming complex oxide nanodots for a charge trap.
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  193. Wu,Chii Ming; Tsai,Ming Hsing; Hsieh,Ching Hua; Shue,Shau Lin, Method of manufacturing a contact interconnection layer containing a metal and nitrogen by atomic layer deposition for deep sub-micron semiconductor technology.
  194. Nakatani, Kimihiko; Harada, Kazuhiro; Kitamura, Masahito, Method of manufacturing semiconductor device and substrate processing apparatus.
  195. LaVoie, Adrien; Saly, Mark J.; Moser, Daniel; Odedra, Rajesh; Konjolia, Ravi, Method of plasma activated deposition of a conformal film on a substrate surface.
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  200. Thombare, Shruti Vivek; Karim, Ishtak; Gopinath, Sanjay; Arghavani, Reza; Danek, Michal, Method to tune TiOx stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiOx/Ti based MIS contact scheme for CMOS.
  201. LaVoie, Adrien; Varadarajan, Bhadri; Henri, Jon; Hausmann, Dennis, Methods for UV-assisted conformal film deposition.
  202. Fu, Xinyu; Tang, Wei; Shah, Kavita; Gandikota, Srinivas; Yu, San H.; Gelatos, Avgerinos, Methods for annealing a contact metal layer to form a metal silicidation layer.
  203. Myo, Nyi Oo; Cho, Kenric; Kher, Shreyas; Narwankar, Pravin; Poppe, Steve; Metzner, Craig R.; Deaten, Paul, Methods for atomic layer deposition of hafnium-containing high-K dielectric materials.
  204. Chang, Mei; Thanh, Linh; Zheng, Bo; Sundarrajan, Arvind; Forster, John C.; Kellkar, Umesh M.; Narasimhan, Murali K., Methods for contact clean.
  205. Kohen, David; Profijt, Harald Benjamin, Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures.
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  223. Jiang, Chong; Chan, Anthony Chih-Tung, Methods of forming a barrier layer in an interconnect structure.
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  226. Ge, Zhenbin; Ritchie, Alan; Allen, Adolph Miller, Methods of forming a metal containing layer on a substrate with high uniformity and good profile control.
  227. Kim, Yihwan; Ye, Zhiyuan; Zojaji, Ali, Methods of forming carbon-containing silicon epitaxial layers.
  228. Kim, Jin Gyun; Hwang, Ki Hyun; Noh, Jin Tae; Kim, Hong Suk; Lee, Sung Hae, Methods of forming conductive polysilicon thin films via atomic layer deposition and methods of manufacturing semiconductor devices including such polysilicon thin films.
  229. Margetis, Joe; Tolle, John, Methods of forming highly p-type doped germanium tin films and structures and devices including the films.
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  236. Zhu, Chiyu; Asikainen, Timo; Milligan, Robert Brennan, NbMC layers.
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  247. Swaminathan, Shankar; Pasquale, Frank L.; LaVoie, Adrien, Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications.
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  251. Nam, Sang Ki; Cho, Tae Seung; Godet, Ludovic; Nemani, Srinivas D., Plasma uniformity control by arrays of unit cell plasmas.
  252. Mahajani, Maitreyee; Yudovsky, Joseph; McDougall, Brendan, Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool.
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  265. Winkler, Jereld Lee, Pulsed remote plasma method and system.
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  267. Lindeboom,Bartholomeus Hans Louis; Snijders,Gert Jan, Reactor design for reduced particulate generation.
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  270. Kumar, Purushottam; LaVoie, Adrien; Karim, Ishtak; Qian, Jun; Pasquale, Frank L.; van Schravendijk, Bart J., Selective atomic layer deposition with post-dose treatment.
  271. Carlson, David K.; Kuppurao, Satheesh; Sanchez, Errol Antonio C.; Beckford, Howard; Kim, Yihwan, Selective deposition.
  272. Chung, Hua; Chen, Ling; Ku, Vincent W.; Yang, Michael X.; Yao, Gongda, Selective deposition of a barrier layer on a dielectric material.
  273. Yoon, Hyungsuk Alexander; Yang, Michael X.; Zhang, Hui; Hong, Soonil; Xi, Ming, Selective deposition of a barrier layer on a metal film.
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  296. Weeks, Keith Doran, Structures and devices including a tensile-stressed silicon arsenic layer and methods of forming same.
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